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DS90LV027AQ-Q1

AKTIV

LVDS-Dual-Differenzialtreiber für die Automobilindustrie

Produktdetails

Function Driver Protocols LVDS Number of transmitters 2 Number of receivers 0 Supply voltage (V) 3.3 Signaling rate (Mbps) 600 Input signal CMOS, TTL Output signal LVDS Rating Automotive Operating temperature range (°C) -40 to 125
Function Driver Protocols LVDS Number of transmitters 2 Number of receivers 0 Supply voltage (V) 3.3 Signaling rate (Mbps) 600 Input signal CMOS, TTL Output signal LVDS Rating Automotive Operating temperature range (°C) -40 to 125
SOIC (D) 8 29.4 mm² 4.9 x 6
  • AECQ-100 Grade 1
  • >600 Mbps (300MHz) Switching Rates
  • 0.3 ns Typical Differential Skew
  • 0.7 ns Maximum Differential Skew
  • 3.3V Power Supply Design
  • Low Power Dissipation (46 mW @ 3.3V Static)
  • Flow-Through Design Simplifies PCB Layout
  • Power Off Protection (Outputs in High Impedance)
  • Conforms to TIA/EIA-644 Standard
  • 8-Lead SOIC Package Saves Space

All trademarks are the property of their respective owners.

  • AECQ-100 Grade 1
  • >600 Mbps (300MHz) Switching Rates
  • 0.3 ns Typical Differential Skew
  • 0.7 ns Maximum Differential Skew
  • 3.3V Power Supply Design
  • Low Power Dissipation (46 mW @ 3.3V Static)
  • Flow-Through Design Simplifies PCB Layout
  • Power Off Protection (Outputs in High Impedance)
  • Conforms to TIA/EIA-644 Standard
  • 8-Lead SOIC Package Saves Space

All trademarks are the property of their respective owners.

The DS90LV027AQ is a dual LVDS driver device optimized for high data rate and low power applications. The device is designed to support data rates in excess of 600Mbps (300MHz) utilizing Low Voltage Differential Signaling (LVDS) technology. The DS90LV027AQ is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized.

The device is in a 8-lead SOIC package. The DS90LV027AQ has a flow-through design for easy PCB layout. The differential driver outputs provides low EMI with its typical low output swing of 360 mV. It is perfect for high speed transfer of clock and data. The DS90LV027AQ can be paired with its companion dual line receiver, the DS90LV028AQ, or with any of TI's LVDS receivers, to provide a high-speed point-to-point LVDS interface.

The DS90LV027AQ is a dual LVDS driver device optimized for high data rate and low power applications. The device is designed to support data rates in excess of 600Mbps (300MHz) utilizing Low Voltage Differential Signaling (LVDS) technology. The DS90LV027AQ is a current mode driver allowing power dissipation to remain low even at high frequency. In addition, the short circuit fault current is also minimized.

The device is in a 8-lead SOIC package. The DS90LV027AQ has a flow-through design for easy PCB layout. The differential driver outputs provides low EMI with its typical low output swing of 360 mV. It is perfect for high speed transfer of clock and data. The DS90LV027AQ can be paired with its companion dual line receiver, the DS90LV028AQ, or with any of TI's LVDS receivers, to provide a high-speed point-to-point LVDS interface.

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Technische Dokumentation

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Typ Titel Datum
* Data sheet DS90LV027AQ Automotive LVDS Dual Differential Driver datasheet (Rev. D) 17 Apr 2013
Application brief LVDS to Improve EMC in Motor Drives 27 Sep 2018
Application brief How Far, How Fast Can You Operate LVDS Drivers and Receivers? 03 Aug 2018
Application brief How to Terminate LVDS Connections with DC and AC Coupling 16 Mai 2018
Application note An Overview of LVDS Technology 05 Okt 1998

Design und Entwicklung

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Evaluierungsplatine

DS90LV027A-28AEVM — Evaluierungsmodul für Zweiknal-LVDS-Treiber und -Empfänger

The DS90LV027A-28A is an evaluation module designed for performance and functional evaluation of the Texas Instruments DS90LV027A LVDS dual  differential driver and DS90LV028A LVDS dual differential line receiver. With this kit, users can quickly evaluate the output waveform characteristics (...)
Simulationsmodell

DS90LV027A IBIS Model

SNLM017.ZIP (8 KB) - IBIS Model
Simulationstool

PSPICE-FOR-TI — PSpice® für TI Design-und Simulationstool

PSpice® für TI ist eine Design- und Simulationsumgebung, welche Sie dabei unterstützt, die Funktionalität analoger Schaltungen zu evaluieren. Diese voll ausgestattete Design- und Simulationssuite verwendet eine analoge Analyse-Engine von Cadence®. PSpice für TI ist kostenlos erhältlich und (...)
Simulationstool

TINA-TI — SPICE-basiertes analoges Simulationsprogramm

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Benutzerhandbuch: PDF
Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
SOIC (D) 8 Ultra Librarian

Bestellen & Qualität

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  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

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