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다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
CSD95490Q5MC
- 75-A Continuous Operating Current Capability
- Over 95% System Efficiency at 30 A
- High-Frequency Operation (up to 1.25 MHz)
- Diode Emulation Function
- Temperature Compensated Bi-Directional Current Sense
- Analog Temperature Output
- Fault Monitoring
- 3.3-V and 5-V PWM Signal Compatible
- Tri-State PWM Input
- Integrated Bootstrap Switch
- Optimized Dead Time for Shoot-Through Protection
- High-Density QFN 5-mm × 6-mm Footprint
- Ultra-Low-Inductance Package
- System Optimized PCB Footprint
- Thermally Enhanced Topside Cooling
- RoHS Compliant – Lead-Free Terminal Plating
- Halogen Free
The CSD95490Q5MC NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.
관심 가지실만한 유사 제품
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
기술 문서
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모두 보기5 | 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | CSD95490Q5MC Synchronous Buck NexFET Smart Power Stage datasheet (Rev. A) | PDF | HTML | 2018/01/09 |
| Application note | Multiphase Buck Design from Start to Finish, Part 1 (Rev. B) | 2021/04/07 | ||
| Technical article | Sequencing and powering FPGAs in radar and other defense applications | PDF | HTML | 2019/11/18 | |
| Technical article | How to use PMBus power solutions for NXP QorIQ processors | PDF | HTML | 2018/05/09 | |
| Technical article | Signal integrity in multiphase, smart power-stage applications | PDF | HTML | 2017/10/10 |
설계 및 개발
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| 패키지 | 핀 | 다운로드 |
|---|---|---|
| VSON-CLIP (DMC) | 12 | 옵션 보기 |
주문 및 품질
포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치