產品詳細資料

Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 800, 1000 CPU 32-bit Display type 2 LCD Protocols Ethernet Hardware accelerators 1 Image Video Accelerator Operating system Linux, RTOS Security Cryptography Rating Catalog Power supply solution TPS650250, TPS65216 Operating temperature range (°C) -40 to 105
Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 800, 1000 CPU 32-bit Display type 2 LCD Protocols Ethernet Hardware accelerators 1 Image Video Accelerator Operating system Linux, RTOS Security Cryptography Rating Catalog Power supply solution TPS650250, TPS65216 Operating temperature range (°C) -40 to 105
FCCSP (CBC) 515 196 mm² 14 x 14 FCCSP (CBP) 515 144 mm² 12 x 12 FCCSP (CUS) 423 256 mm² 16 x 16
  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

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技術文件

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類型 標題 日期
* Data sheet DM3730, DM3725 Digital Media Processors datasheet (Rev. D) 2011年 4月 11日
* Errata DM3730, DM3725 Digital Media Processors Silicon Errata (Revs 1.2, 1.1 & 1.0) (Rev. F) 2014年 2月 13日
* User guide AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R) 2012年 9月 24日
Application note OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles 2019年 3月 20日
More literature Ethernet Connectivity via GPMC 2018年 7月 6日
More literature AM37x/DM37x Schematic Checklist 2018年 7月 6日
More literature AM37x EVM Software Developer's Guide 2018年 7月 6日
Technical article Spring has sprung. A sale has sprung. PDF | HTML 2016年 4月 4日
User guide Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q) 2012年 9月 10日
More literature DM37x Design Network Partners 2012年 6月 5日
Application note Introduction to TMS320C6000 DSP Optimization 2011年 10月 6日
Application note PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs 2011年 6月 15日
Application note PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II 2010年 6月 23日
Application note PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I 2010年 6月 23日
Application note AM/DM37x Power Estimation Spreadsheet 2010年 6月 7日
Application note AM/DM37x Overview 2010年 6月 3日
Application note AM3715/03 Memory Subsystem 2010年 6月 3日
Application note AM37x CUS Routing Guidelines 2010年 6月 3日
Application note Setting up AM37x SDRC Registers 2010年 6月 3日

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偵錯探測器

TMDSEMU200-U — XDS200 USB 偵錯探測器

XDS200 是為 TI 嵌入式裝置偵錯的偵錯探測器 (模擬器)。與低成本 XDS110 和高效能 XDS560v2 相比,XDS200 是兼具低成本與優異效能的完美平衡,可在單一 pod 中支援各種標準 (IEEE1149.1、IEEE1149.7、SWD)。所有 XDS 偵錯探測器均支援具嵌入式追踪緩衝區 (ETB) 的 Arm® 與 DSP 處理器中的核心和系統追蹤功能。透過針腳進行核心追蹤則需要 XDS560v2 PRO TRACE

XDS200 透過 TI 20 針腳連接器 (配備適用 TI 14 針腳、Arm Cortex® 10 針腳和 Arm 20 針腳的多重轉接器) (...)

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偵錯探測器

TMDSEMU560V2STM-U — XDS560v2 System Trace USB 偵錯探測器

XDS560v2 是 XDS560™ 偵錯探測器系列的最高性能表現,支援傳統 JTAG 標準 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。請注意,序列線偵錯 (SWD) 不受支援。

所有 XDS 偵錯探測器均支援所有具有嵌入式追踪緩衝區 (ETB) 的 ARM 和 DSP 處理器中的核心和系統追蹤功能。對於針腳追蹤則需要 XDS560v2 PRO TRACE

XDS560v2 透過 MIPI HSPT 60 針腳接頭 (具有用於 TI 14 針腳、TI 20 針腳和 ARM 20 針腳的多轉接器) 連接到目標電路板,並透過 USB2.0 高速 (480Mbps) (...)

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偵錯探測器

TMDSEMU560V2STM-UE — XDS560v2 System Trace USB 與乙太網路偵錯探測器

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

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軟體開發套件 (SDK)

ANDROIDEVKIT-FROYO Android FROYO - Dev Kit for DM37x (TI_Android_DevKit/02_02_00)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

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產品
Arm 式處理器
DM3725 數位媒體處理器 DM3730 數位媒體處理器
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軟體開發套件 (SDK)

ANDROIDEVKIT-GINGERBREAD Android GINGERBREAD 2.3 - Dev Kit for DM37x (TI_Android_GingerBread_2_3_DevKit_1_0)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

支援產品和硬體

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產品
Arm 式處理器
DM3725 數位媒體處理器 DM3730 數位媒體處理器
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軟體開發套件 (SDK)

LINUXDVSDK-DM37X — 用於 DM3730/3725 數位媒體處理器的 Linux 數位視訊軟體開發套件 (DVSDK)

The Linux Digital Video Software Development Kit (DVSDK) for DaVinci™ processors provides everything developers need to evaluate and start developing on the DM37x Cortex™-A8 DSP+ARM® microprocessors. With the included Graphical User Interface (GUI)-based Matrix Application Launcher, launching (...)
IDE、配置、編譯器或偵錯程式

CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

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軟體程式設計工具

FLASHTOOL FlashTool for AM35x, AM37x, DM37x and OMAP35x Devices

Flash Tool is a Windows-based application that can be used to transfer binary images from a host PC to TI Sitara AM35x, AM37x, DM37x and OMAP35x target platforms.


Additional Information:

TI GForge - Welcome to gforge.ti.com

TI E2E Community

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產品
Arm 式處理器
AM3505 Sitara 處理器:Arm Cortex-A8、視訊前端 AM3517 Sitara 處理器:ARM Cortex-A8、3D 圖形、視訊前端 AM3703 Sitara 處理器:Arm Cortex-A8、攝影機 AM3715 Sitara 處理器:ARM Cortex-A8、3D 圖形、攝影機 DM3725 數位媒體處理器 DM3730 數位媒體處理器 OMAP3503 Sitara 處理器:ARM Cortex-A8、LPDDR OMAP3515 Sitara 處理器:ARM Cortex-A8、3D 圖形、LPDDR OMAP3525 應用處理器 OMAP3530 應用處理器
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模擬型號

AM/DM37x CBC BSDL Model (Rev. B)

SPRM507B.ZIP (8 KB) - BSDL Model
模擬型號

AM/DM37x CBC IBIS Model

SPRM510.ZIP (4410 KB) - IBIS Model
模擬型號

AM/DM37x CBP BSDL Model

SPRM506.ZIP (9 KB) - BSDL Model
模擬型號

AM/DM37x CBP IBIS Model

SPRM509.ZIP (4408 KB) - IBIS Model
模擬型號

AM/DM37x CUS BSDL Model

SPRM508.ZIP (10 KB) - BSDL Model
模擬型號

AM/DM37x CUS IBIS Model

SPRM511.ZIP (4255 KB) - IBIS Model
設計工具

PROCESSORS-3P-SEARCH — Arm 架構 MPU、arm 架構 MCU 和 DSP 第三方搜尋工具

TI 已與公司合作,提供各種使用 TI 處理器的軟體、工具和 SOM 以加速生產。下載此搜尋工具,以快速瀏覽我們的第三方解決方案,並找出符合您需求的正確協力廠商。此處列出的軟體、工具和模組,皆由獨立第三方而非由德州儀器生產及管理。

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  • SOM 意指系統模組解決方案
封裝 引腳 下載
FCCSP (CBC) 515 檢視選項
FCCSP (CBP) 515 檢視選項
FCCSP (CUS) 423 檢視選項

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