首頁 微控制器 (MCU) 與處理器 Arm 式處理器
首頁
微控制器 (MCU) 與處理器
Arm 式處理器

DM3730

現行

數位媒體處理器

立即訂購
產品規格表
使用指南
勘誤表

DM3730

現行
產品規格表 立即訂購

產品詳細資料

Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 800, 1000 Coprocessors GPU CPU 32-bit Graphics acceleration 1 3D Display type 2 LCD Protocols Ethernet Hardware accelerators 1 Image Video Accelerator, SGX Graphics Operating system Linux, RTOS Rating Catalog Operating temperature range (°C) -40 to 105
Arm CPU 1 Arm Cortex-A8 Arm (max) (MHz) 800, 1000 Coprocessors GPU CPU 32-bit Graphics acceleration 1 3D Display type 2 LCD Protocols Ethernet Hardware accelerators 1 Image Video Accelerator, SGX Graphics Operating system Linux, RTOS Rating Catalog Operating temperature range (°C) -40 to 105
FCCSP (CBC) 515 196 mm² 14 x 14 FCCSP (CBP) 515 144 mm² 12 x 12 FCCSP (CUS) 423 256 mm² 16 x 16
  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.
  • DM3730, DM3725 Digital Media Processors:
    • Compatible with OMAP™ 3 Architecture
    • ARM® microprocessor (MPU) Subsystem
      • Up to 1-GHz ARM® Cortex™-A8 Core, Also supports 300, 600, and 800-MHz
      • NEON SIMD Coprocessor
    • High Performance Image, Video, Audio (IVA2.2™) Accelerator Subsystem
      • Up to 800-MHz TMS320C64x+™ DSP Core
      • Enhanced Direct Memory Access (EDMA) Controller (128 Independent Channels)
      • Video Hardware Accelerators
    • POWER SGX™ Graphics Accelerator (DM3730 only)
      • Tile Based Acrchitecture Delivering up to 20 MPoly/sec
      • Universal Scalable Shader Engine: Multi-threaded Engine Incorporating Pixel and Vertex Shader Functionality
      • Industry Standard API Support: OpenGLES 1.1 and 2.0, OpenVG1.0
      • Fine Grained Task Switching, Load Balancing, and Power Management
      • Programmable High Quality Image Anti-Aliasing
    • Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
      • Eight Highly Independent Functional Units
      • Six ALUs (32-/40-Bit); Each Supports Single 32- bit, Dual 16-bit, or Quad 8-bit, Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-bit Multiplies (16-Bit Results) per Clock Cycle
      • Load-Store Architecture With Non-Aligned Support
      • 64 32-Bit General-Purpose Registers
      • Instruction Packing Reduces Code Size
      • All Instructions Conditional
      • Additional C64x+™ Enhancements
        • Protected Mode Operation
        • Expectations Support for Error Detection and Program Redirection
        • Hardware Support for Modulo Loop Operation
    • C64x+TM L1/L2 Memory Architecture

POWERVR SGX is a trademark of Imagination Technologies Ltd.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.All trademarks are the property of their respective owners.

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

  • Portable Data Terminals
  • Navigation
  • Auto Infotainment
  • Gaming
  • Medical Imaging
  • Home Automation
  • Human Interface
  • Industrial Control
  • Test and Measurement
  • Single board Computers

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

  • A description of the DM3730/25 terminals: assignment, electrical characteristics, multiplexing, and functional description
  • A presentation of the electrical characteristics requirements: power domains, operating conditions, power consumption, and dc characteristics
  • The clock specifications: input and output clocks, DPLL and DLL
  • A description of thermal characteristics, device nomenclature, and mechanical data about the available packaging
open-in-new 尋找其它 Arm 式處理器
下載 觀看有字幕稿的影片 影片

TI 提供有限的設計支援

此產品具有 TI 針對現有專案提供的有限設計支援。若有提供，您可在產品資料夾中找到相關資訊、軟體與工具。對於使用此產品的現有設計，您可以在 TI E2ETM 支援論壇中要求支援，但此產品提供的支援有限。

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件，然後再試一次。
檢視所有 27
類型 標題 日期
* Data sheet DM3730, DM3725 Digital Media Processors datasheet (Rev. D) 2011年 4月 11日
* Errata DM3730, DM3725 Digital Media Processors Silicon Errata (Revs 1.2, 1.1 & 1.0) (Rev. F) 2014年 2月 13日
* User guide AM/DM37x Multimedia Device Technical Reference Manual (Silicon Revision 1.x) (Rev. R) 2012年 9月 24日
Application note OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles 2019年 3月 20日
More literature Ethernet Connectivity via GPMC 2018年 7月 6日
More literature AM37x/DM37x Schematic Checklist 2018年 7月 6日
More literature AM37x EVM Software Developer's Guide 2018年 7月 6日
Technical article Enabling Wi-Fi® and Bluetooth® connectivity on RTOS PDF | HTML 2016年 4月 13日
Technical article Spring has sprung. A sale has sprung. PDF | HTML 2016年 4月 4日
Application note Plastic Ball Grid Array [PBGA] Application Note (Rev. B) 2015年 8月 13日
Technical article Selecting the right processor: WiLink 8 plug and play platforms PDF | HTML 2015年 6月 26日
Application note PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A) 2013年 11月 1日
User guide Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q) 2012年 9月 10日
More literature DM37x Design Network Partners 2012年 6月 5日
Application note TI OMAP4430 POP SMT Design Guideline (Rev. C) 2011年 11月 3日
Application note Introduction to TMS320C6000 DSP Optimization 2011年 10月 6日
Application note PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs 2011年 6月 15日
Product overview DM3730 Product Bulletin 2010年 9月 7日
Application note PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II 2010年 6月 23日
Application note PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I 2010年 6月 23日
Application note AM/DM37x Power Estimation Spreadsheet 2010年 6月 7日
Application note AM/DM37x Overview 2010年 6月 3日
Application note AM3715/03 Memory Subsystem 2010年 6月 3日
Application note AM37x CUS Routing Guidelines 2010年 6月 3日
Application note Setting up AM37x SDRC Registers 2010年 6月 3日
User guide Flip Chip Ball Grid Array Package Reference Guide (Rev. A) 2005年 5月 23日
Application note AN-1281 Bumped Die (Flip Chip) Packages (Rev. A) 2004年 5月 1日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

軟體開發套件 (SDK)

ANDROIDEVKIT-FROYO — Android FROYO - Dev Kit for DM37x (TI_Android_DevKit/02_02_00)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

支援產品和硬體

支援產品和硬體

產品
Arm 式處理器
DM3725 — 數位媒體處理器 DM3730 — 數位媒體處理器
下載選項
軟體開發套件 (SDK)

ANDROIDEVKIT-GINGERBREAD — Android GINGERBREAD 2.3 - Dev Kit for DM37x (TI_Android_GingerBread_2_3_DevKit_1_0)

Although originally designed for mobile handsets, the Android™ operating system offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and (...)

支援產品和硬體

支援產品和硬體

產品
Arm 式處理器
DM3725 — 數位媒體處理器 DM3730 — 數位媒體處理器
下載選項
軟體開發套件 (SDK)

LINUXDVSDK-DM37X — 用於 DM3730/3725 數位媒體處理器的 Linux 數位視訊軟體開發套件 (DVSDK)

The Linux Digital Video Software Development Kit (DVSDK) for DaVinci™ processors provides everything developers need to evaluate and start developing on the DM37x Cortex™-A8 DSP+ARM® microprocessors. With the included Graphical User Interface (GUI)-based Matrix Application Launcher, launching (...)
檢視選項
驅動程式或資料庫

TELECOMLIB — 電信和媒體庫 - 用於 TMS320C64x+ 和 TMS320C55x 處理器的 FAXLIB、VoLIB 和 AEC/AER

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)
檢視選項
IDE、配置、編譯器或偵錯程式

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It comprises a suite of tools used to develop and debug embedded applications.  Code Composer Studio is available for download across Windows®, Linux® and macOS® (...)

支援產品和硬體

支援產品和硬體

此設計資源支援此類別中多數產品。

檢查產品詳細資料頁面以確認支援。
啟動 下載選項
軟體程式設計工具

FLASHTOOL — FlashTool for AM35x, AM37x, DM37x and OMAP35x Devices

Flash Tool is a Windows-based application that can be used to transfer binary images from a host PC to TI Sitara AM35x, AM37x, DM37x and OMAP35x target platforms.


Additional Information:

TI GForge - Welcome to gforge.ti.com

TI E2E Community

支援產品和硬體

支援產品和硬體

產品
Arm 式處理器
AM3505 — Sitara 處理器：Arm Cortex-A8、視訊前端 AM3517 — Sitara 處理器：ARM Cortex-A8、3D 圖形、視訊前端 AM3703 — Sitara 處理器：Arm Cortex-A8、攝影機 AM3715 — Sitara 處理器：ARM Cortex-A8、3D 圖形、攝影機 DM3725 — 數位媒體處理器 DM3730 — 數位媒體處理器 OMAP3503 — Sitara 處理器：ARM Cortex-A8、LPDDR OMAP3515 — Sitara 處理器：ARM Cortex-A8、3D 圖形、LPDDR OMAP3525 — 應用處理器 OMAP3530 — 應用處理器
下載選項
模擬型號

AM/DM37x CBC BSDL Model (Rev. B)

SPRM507B.ZIP (8 KB) - BSDL Model
下載
模擬型號

AM/DM37x CBC IBIS Model

SPRM510.ZIP (4410 KB) - IBIS Model
下載
模擬型號

AM/DM37x CBP BSDL Model

SPRM506.ZIP (9 KB) - BSDL Model
下載
模擬型號

AM/DM37x CBP IBIS Model

SPRM509.ZIP (4408 KB) - IBIS Model
下載
模擬型號

AM/DM37x CUS BSDL Model

SPRM508.ZIP (10 KB) - BSDL Model
下載
模擬型號

AM/DM37x CUS IBIS Model

SPRM511.ZIP (4255 KB) - IBIS Model
下載
設計工具

PROCESSORS-3P-SEARCH — Arm 架構 MPU、arm 架構 MCU 和 DSP 第三方搜尋工具

TI 已與公司合作，提供各種使用 TI 處理器的軟體、工具和 SOM 以加速生產。下載此搜尋工具，以快速瀏覽我們的第三方解決方案，並找出符合您需求的正確協力廠商。此處列出的軟體、工具和模組，皆由獨立第三方而非由德州儀器生產及管理。

搜尋工具會依產品類型分類，如下所示：

  • 工具包括 IDE/編譯器、偵錯和追蹤、模擬和建模軟體及快閃程式設計師。
  • OS 包含 TI 處理器支援的作業系統。
  • 應用軟體意指特定應用程式軟體，包括在 TI 處理器上執行的中介軟體和程式庫。
  • SOM 意指系統模組解決方案
下載
參考設計

TIDA-00408 — 適用於建築自動化與醫療應用的觸覺回饋電容式觸控顯示器參考設計

The TIDA-00408 Touch Display with Haptic Feedback reference design showcases haptics for thermostats, building automation, factory automation, point of sale, and automotive applications.  The touch screen provides touch feedback when the user interacts with the on-screen user interface.  (...)
Design guide: PDF
電路圖: PDF
封裝 引腳 下載
FCCSP (CBC) 515 檢視選項
FCCSP (CBP) 515 檢視選項
FCCSP (CUS) 423 檢視選項
適用 TI 的評估品項標準條款與條件。

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

以英文檢視所有論壇主題

內容係由 TI 和社群貢獻者依「現狀」提供，且不構成 TI 規範。檢視使用條款。

若有關於品質、封裝或訂購 TI 產品的問題，請參閱 TI 支援。​​​​​​​​​​​​​​

影片