BOOSTXL-CC2650MA

TI SimpleLink™ Bluetooth® low energy CC2650 Module BoosterPack™ Plug-in Module

BOOSTXL-CC2650MA

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Overview

The SimpleLink™ Bluetooth® low energy CC2650 Module BoosterPack plug-in module is the quick and easy way to add Bluetooth low energy to your LaunchPad™ development kit. Simply plug the CC2650 module BoosterPack kit into the MSP432™ microcontroller (MCU) LaunchPad kit to get started! The software example to get started with development is found here.

The CC2650 module BoosterPack kit is programmed with a wireless network processor software that allows you to add Bluetooth low energy connectivity to any application using simple UART interface. The module BoosterPack kit also includes a JTAG connection for programming and debugging the CC2650 module. This allows you to develop any Bluetooth low energy application on the CC2650 module.

Note: To use the software examples and the CC2650 Module BoosterPack, you also need a MSP432 LaunchPad kit. A bundle of the two EVMs is available.

Features
  • Bluetooth low energy module BoosterPack kit using the CC2650 Module with integrated antenna
  • Includes software examples for MSP432 MCU as application processor
  • Pre-certified for FCC/IC, CE, and ARIB radio standards
  • Debug interface for development of any Bluetooth low energy application on module
  • Bluetooth 4.2 specification certified

Low-power 2.4-GHz products
CC2630 SimpleLink™ 32-bit Arm Cortex-M3 Zigbee and 6LoWPAN wireless MCU with 128kB Flash CC2640 SimpleLink™ 32-bit Arm Cortex-M3 Bluetooth® Low Energy wireless MCU with 128kB Flash CC2650 SimpleLink™ 32-bit Arm Cortex-M3 multiprotocol 2.4 GHz wireless MCU with 128kB Flash CC2650MODA SimpleLink™ 32-bit Arm Cortex-M3 multiprotocol 2.4 GHz wireless module with 128kB Flash
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BOOSTXL-CC2650MA — TI SimpleLink™ Bluetooth® low energy CC2650 Module BoosterPack™ Plug-in Module

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Plug-in

SIMPLELINK-SDK-BLUETOOTH-PLUGIN — Bluetooth Plug-in for SimpleLink™ MCU SDK

Supported products & hardware
Download options

SIMPLELINK-SDK-BLUETOOTH-PLUGIN Bluetooth Plug-in for SimpleLink™ MCU SDK

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Latest version
Version: 3.20.00.24
Release date: 31 Jul 2019

Windows Installer for SimpleLink SDK BLE Plugin

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macOS Installer for SimpleLink SDK BLE Plugin

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Linux Installer for SimpleLink SDK BLE Plugin

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Products
Wi-Fi products
CC3220S SimpleLink™ 32-bit Arm Cortex-M4 Wi-Fi® wireless MCU with secure boot and 256kB RAM CC3220SF SimpleLink™ 32-bit Arm Cortex-M4 Wi-Fi® wireless MCU with 1MB Flash and 256kB RAM CC3235S SimpleLink™ 32-bit Arm Cortex-M4 dual-band Wi-Fi® wireless MCU with 256kB RAM CC3235SF SimpleLink™ 32-bit Arm Cortex-M4 dual-band Wi-Fi® wireless MCU with 1MB Flash
Arm Cortex-M4 MCUs
MSP432E401Y SimpleLink™ 32-bit Arm Cortex-M4F MCU with ethernet, CAN, 1MB Flash and 256kB RAM MSP432E411Y SimpleLink™ 32-bit Arm Cortex-M4F MCU with ethernet, CAN, TFT LCD, 1MB Flash and 256kB RAM<
Low-power 2.4-GHz products
CC2640 SimpleLink™ 32-bit Arm Cortex-M3 Bluetooth® Low Energy wireless MCU with 128kB Flash CC2642R SimpleLink™ 32-bit Arm Cortex-M4F Bluetooth® Low Energy wireless MCU with 352kB Flash CC2650 SimpleLink™ 32-bit Arm Cortex-M3 multiprotocol 2.4 GHz wireless MCU with 128kB Flash CC2650MODA SimpleLink™ 32-bit Arm Cortex-M3 multiprotocol 2.4 GHz wireless module with 128kB Flash CC2652R SimpleLink™ 32-bit Arm Cortex-M4F multiprotocol 2.4 GHz wireless MCU with 352kB Flash
Hardware development
BOOSTXL-CC2650MA TI SimpleLink™ Bluetooth® low energy CC2650 Module BoosterPack™ Plug-in Module CC3220S-LAUNCHXL CC3220S LaunchPad™ development kit for Wi-Fi® SimpleLink™ wireless MCU CC3220SF-LAUNCHXL CC3220SF LaunchPad™ development kit for Wi-Fi® SimpleLink™ wireless MCU LAUNCHXL-CC2640R2 CC2640R2 LaunchPad™ development kit for SimpleLink™ Bluetooth® Low Energy wireless MCU LAUNCHXL-CC26X2R1 CC26x2R LaunchPad™ development kit for multi-standard SimpleLink™ wireless MCU LAUNCHXL-CC3235S CC3235S dual-band LaunchPad™ development kit for Wi-Fi® SimpleLink™ MCU LAUNCHXL-CC3235SF CC3235SF dual-band LaunchPad™ development kit for Wi-Fi® SimpleLink™ MCU MSP-EXP432E401Y MSP432E401Y LaunchPad™ development kit for Ethernet SimpleLink™ MCU

Documentation

SimpleLink SDK BLE Plugin User's Guide

What's new

  • This version of the SimpleLink Bluetooth Plugin now enables a BLE two-chip solution to act as a GAP Central role. Previous versions of this plugin only included support for GAP Peripheral role. This new functionality is showcased through the addition of the new simple_central example, which uses the MSP432E401Y as the Host device and the CC26x2R1 as the NWP. The simple_central example demonstrates the following features:
    • Host: MSP432E401Y
    • NWP: CC26X2R1
    • GAP Central role support
    • Host Controller Interface (HCI) protocol used for communication with the NWP
    • BLE5 support
    • Power management
    • Low Energy Secure Connection (LESC) Pairing
    • Tested with up to 4 peripherals connected simultaneously (but can support more than 4 connections)
    • Supports a subset of TI Vendor Specific HCI commands and Bluetooth LE HCI commands/events. More information on these APIs can be found BLE Vendor Specific API Guide.
    • Works out-of-box with the Sensors BoosterPack and Project Zero examples that are also in the SimpleLink SDK Bluetooth Plugin.
    • The GAP Central source code is also showcased in a separate downloadable: the SimpleLink BLE Plugin Azure Gateway Example Pack. This example pack demonstrates enabling a user’s BLE two-chip solution to become a gateway to the Azure IoT cloud. The SimpleLink BLE Plugin Azure Gateway Example Pack can be found on www.ti.com.

Release Infomation

The SimpleLink™ SDK BLE Plugin is a companion software package that enables the use of a Bluetooth radio on any standard MSP432P4 platform, MSP432E4 or CC32XX platform, and enables this two-chip solution to act as either a GAP Peripheral role or a GAP Central role. By having the ability to seamlessly and modularly add Bluetooth functionality (more specifically Bluetooth Low Energy/BLE) to an embedded system, a programmer can enable their embedded device to become a gateway to various IOT infrastructures.

For examples demonstrating the two-chip solution in a peripheral role, the plugin leverages the use of the TI Simple Application Processor (SAP) driver connected to a CC26xx Simple Network Processor (SNP) to provide a highly customizable hardware configuration. For software connectivity between the SAP and the SNP, an architecture agnostic HAL/Drivers layer is used to promote software portability and maximize collateral reuse.

For examples demonstrating the two-chip solution in a central role, communication between the NWP and the Host occurs through a UART serial interface using the Host Controller Interface (HCI) protocol. TI Vendor Specific HCI commands and a limited subset of Bluetooth LE HCI commands/events to implement a Bluetooth application. By using TI Vendor Specific commands and events, the application can communicate with and access the BLE stack.

Driver or library

BLE-STACK-2-X — BLE-STACK - V2.2 (Support for CC2640/CC2650)

Supported products & hardware
Download options

BLE-STACK-2-X BLE-STACK - V2.2 (Support for CC2640/CC2650)

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Latest version
Version: 2.02.07.06
Release date: 30 Nov 2021

Windows Installer for Simplelink BLE 2 x SDK

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Link to Windows Installer for Code Composer Studio IDE

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Products
Low-power 2.4-GHz products
CC2640 SimpleLink™ 32-bit Arm Cortex-M3 Bluetooth® Low Energy wireless MCU with 128kB Flash CC2650 SimpleLink™ 32-bit Arm Cortex-M3 multiprotocol 2.4 GHz wireless MCU with 128kB Flash
Hardware development
BOOSTXL-CC2650MA TI SimpleLink™ Bluetooth® low energy CC2650 Module BoosterPack™ Plug-in Module CC2650RC SimpleLink™ Bluetooth® low energy/ZigBee® RF4CE™ CC2650 remote control CC2650STK SimpleLink™ Bluetooth low energy/Multi-standard SensorTag LAUNCHXL-CC2650 SimpleLink™ CC2650 wireless MCU LaunchPad™ Development Kit

Documentation

Archive Installers for Simplelink BLE 2 x SDK

Release Infomation

This is version 2.2.7 of the TI Bluetooth® low energy protocol stack Software Development Kit (SDK). The BLE-Stack SDK allows for the development of single-mode Bluetooth low energy (BLE) applications on TI's first generation SimpleLink Bluetooth low energy CC2640 and Multi-Standard CC2650 wireless microcontroller units (MCUs) supporting version 5.1 of the Bluetooth specification with features defined by version 4.2 of the Bluetooth specification. The CC26x0 family of wireless MCUs includes a 32-bit Arm® Cortex™-M3 as the main application CPU running at 48 MHz, a dedicated Cortex-M0 processor for the radio / Physical Layer (PHY), and an autonomous Sensor Controller Engine for low-power sensing applications. The BLE protocol stack is built on top of the TI Real-time Operating System (TI-RTOS) which provides advanced power management and flexible peripheral driver capabilities allowing the development of highly optimized and power efficient standalone or network processor applications. The TI-RTOS SDK is installed during the BLE-Stack SDK installation.

Version 2.2.7 of the BLE-Stack is a maintenance update to TI's existing royalty-free Bluetooth low energy software protocol stack which is certified for Bluetooth specification version 5.1. This release includes support for all core specification version 4.2 Low Energy (LE) features as well as several development kits. This protocol stack update is in addition to support of all major Bluetooth LE core specification version 4.1 features, including support for up to 8 master or slave BLE connections. Please note that no Bluetooth 5 or Bluetooth 5.1 features are supported. A few examples of what can be created using the sample applications in this SDK and/or the additional resources found in the Examples section below include Bluetooth beacons incorporating the popular Apple iBeacon® and Eddystone™ formats, glucose, heart rate and fitness monitors, dongles for cable replacement via a BLE Serial Port Bridge and industrial motor monitors.

See What's New section for an overview of the changes included in this release. The Bluetooth core specification version 4.2 features supported in this release allow development of the most secure and power efficient products incorporating the Bluetooth low energy specification.

What's new

  • [Errata 17113] Impersonation the Passkey Entry Protocol -- do not except the same x coordinate of the public key during pairing.
  • Impersonation the Passkey Entry Protocol -- exclude debug keys from rejection of mirror attack.
Certification

CC26XX-REPORTS — CC26xx Regulatory Certification Reports

Supported products & hardware
Download options

CC26XX-REPORTS CC26xx Regulatory Certification Reports

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Latest version
Version: 7.20.00.00
Release date: 08 May 2023
Products
Low-power 2.4-GHz products
CC2642R SimpleLink™ 32-bit Arm Cortex-M4F Bluetooth® Low Energy wireless MCU with 352kB Flash CC2650MODA SimpleLink™ 32-bit Arm Cortex-M3 multiprotocol 2.4 GHz wireless module with 128kB Flash CC2651R3SIPA SimpleLink™ multiprotocol 2.4-GHz wireless system-in-package module with integrated antenna CC2652PSIP SimpleLink™ multiprotocol 2.4-GHz wireless system-in-package module with integrated power amplifier CC2652R SimpleLink™ 32-bit Arm Cortex-M4F multiprotocol 2.4 GHz wireless MCU with 352kB Flash CC2652RSIP SimpleLink™ multiprotocol 2.4-GHz wireless system-in-package module with 352-KB memory
Hardware development
BOOSTXL-CC2650MA TI SimpleLink™ Bluetooth® low energy CC2650 Module BoosterPack™ Plug-in Module
Evaluation board
LP-CC2652PSIP CC2562PSIP LaunchPad™ development kit for SimpleLink™ multiprotocol 2.4-GHz wireless SIP module LP-CC2651R3SIPA CC2651R3SIPA LaunchPad™ development kit for SimpleLink™ multiprotocol 2.4-GHz wireless SIP module

Documentation

Link to FCC, ISED, CE, & Japan Certification Reports

Link to FCC, ISED, CE, & UK, Japan, Korea, and Taiwan Certification Reports

Link to FCC, ISED, CE, & UK Certification Reports

Link to FCC, ISED, CE, & UK Certification Reports

Link to CC3230x-CC26x2EM-7ID Reference-Only CE & FCC Certification Reports

Release Infomation

This page provides access to the CC26XX certification reports. Here you will find certification reports for both modules and EVMs. Note that module certification reports can be reused by the customer for regulatory compliance. However the customer should consult with their regulatory house to ensure they meet the requirements for certification at their product level. EVM certification reports are provided for reference only. When using a chip down version, the customer is responsible for their own certification.

What's new

  • Updated CC2651R3SIPAT0MOUR with Japan, Korea, and Tiawan reports
  • Updated CC2652RSIPMOT CE with missing safety report
TI's Standard Terms and Conditions for Evaluation Items apply.

Design files

Technical documentation

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Type Title Date
* User guide CC2650 Module BoosterPack™ Getting Started Guide (Rev. A) 29 Jun 2016
Certificate BOOSTXL-CC2650MA EU Declaration of Conformity (DoC) 02 Jan 2019
E-book TI-RSLK modules 1 - 20 (Rev. A) 30 May 2018
More literature Introduction: Sensor Integration 17 Nov 2017
More literature Lab: Sensor Integration 17 Nov 2017
More literature Jacki Project Lecture 17 Nov 2017
Application note Running Standalone Bluetooth® low energy Applications on CC2650 Module (Rev. A) PDF | HTML 07 Jun 2017
Application note Running Standalone Bluetooth® low energy Applications on CC2650 Module 18 Jan 2017

Related design resources

Hardware development

DEVELOPMENT KIT
CC2650STK SimpleLink™ Bluetooth low energy/Multi-standard SensorTag LAUNCHXL-CC1350 CC1350 LaunchPad™ development kit for SimpleLink™ dual-band wireless MCU LAUNCHXL-CC2650 SimpleLink™ CC2650 wireless MCU LaunchPad™ Development Kit

Software development

DRIVER OR LIBRARY
BLE-STACK Bluetooth Low Energy software stack

Reference designs

REFERENCE DESIGN
TIDC-SPPBLE-SW-RD UART to Bluetooth® Low Energy (BLE) Bridge Reference Design

Support & training

TI E2E™ forums with technical support from TI engineers

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