SBAS603B April 2013 – November 2020 ADS4449
PRODUCTION DATA
| THERMAL METRIC(1) | ADS4449 | UNIT | |
|---|---|---|---|
| ZCR (NFBGA) | |||
| 144 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 35.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 5.1 | °C/W |
| RθJB | Junction-to-board thermal resistance | 12.6 | °C/W |
| ψJT | Junction-to-top characterization parameter | 0.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 12.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |