SBAS603B April   2013  – November 2020 ADS4449

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Digital Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Timing Characteristics, Serial interface
    9. 6.9  Typical Characteristics
    10. 6.10 Typical Characteristics: Contour
  7. Parameter Measurement Information
    1. 7.1 LVDS Output Timing
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Overrange Indication (OVRxx)
      2. 8.3.2 Gain for SFDR and SNR Trade-Off
    4. 8.4 Device Functional Modes
      1. 8.4.1 Special Performance Modes
      2. 8.4.2 Digital Output Information
        1. 8.4.2.1 DDR LVDS Outputs
          1. 8.4.2.1.1 LVDS Output Data and Clock Buffers
          2. 8.4.2.1.2 Output Data Format
      3. 8.4.3 Using High SNR Mode Register Settings
      4. 8.4.4 Input Common Mode
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Register Initialization
        2. 8.5.1.2 Serial Register Readout
    6. 8.6 Register Maps
      1. 8.6.1 Register Description
        1. 8.6.1.1  Register Address 00h (Default = 00h)
        2. 8.6.1.2  Register Address 01h (Default = 00h)
        3. 8.6.1.3  Register Address 25h (Default = 00h)
        4. 8.6.1.4  Register Address 2bh (Default = 00h)
        5. 8.6.1.5  Register Address 31h (Default = 00h)
        6. 8.6.1.6  Register Address 37h (Default = 00h)
        7. 8.6.1.7  Register Address 3dh (Default = 00h)
        8. 8.6.1.8  Register Address 3fh (Default = 00h)
        9. 8.6.1.9  Register Address 40h (Default = 00h)
        10. 8.6.1.10 Register Address 42h (Default = 00h)
        11. 8.6.1.11 Register Address 45h (Default = 00h)
        12. 8.6.1.12 Register Address 4ah (Defalut = 00h)
        13. 8.6.1.13 Register Address 62h (Default = 00h)
        14. 8.6.1.14 Register Address 7ah (Default = 00h)
        15. 8.6.1.15 Register Address 92h (Default = 00h)
        16. 8.6.1.16 Register Address A9h (Default = 00h)
        17. 8.6.1.17 Register Address Ach (Default = 00h)
        18. 8.6.1.18 Register Address C3h (Default = 00h)
        19. 8.6.1.19 Register Address C4h (Default = 00h)
        20. 8.6.1.20 Register Address Cfh (Default = 00h)
        21. 8.6.1.21 Register Address D6h (Default = 00h)
        22. 8.6.1.22 Register Address D7h (Default = 00h)
        23. 8.6.1.23 Register Address F1h (Default = 00h)
        24. 8.6.1.24 Register Address 58h (Default = 00h)
        25. 8.6.1.25 Register Address 59h (Default = 00h)
        26. 8.6.1.26 Register Address 70h (Default = 00h)
        27. 8.6.1.27 Register Address 71h (Default = 00h)
        28. 8.6.1.28 Register Address 88h (Default = 00h)
        29. 8.6.1.29 Register Address 89h (Default = 00h)
        30. 8.6.1.30 Register Address A0h (Default = 00h)
        31. 8.6.1.31 Register Address A1h (Default = 00h)
        32. 8.6.1.32 Register Address Feh (Default = 00h)
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
      4. 9.2.4 Enabling 14-Bit Resolution
      5. 9.2.5 Analog Input
      6. 9.2.6 Drive Circuit Requirements
      7. 9.2.7 Clock Input
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

The ADS4449 EVM layout can be used as a reference layout to obtain the best performance. A layout diagram of the EVM top layer is provided in Figure 11-1. Some important points to remember during laying out the board are:

  • Analog inputs are located on opposite sides of the device pin out to ensure minimum crosstalk on the package level. To minimize crosstalk onboard, the analog inputs should exit the pin out in opposite directions, as shown in the reference layout of Figure 66 as much as possible.
  • In the device pin out, the sampling clock is located on a side perpendicular to the analog inputs in order to minimize coupling between them. This configuration is also maintained on the reference layout of Figure 66 as much as possible.
  • Digital outputs should be kept away from the analog inputs. When these digital outputs exit the pin out, the digital output traces should not be kept parallel to the analog input traces because this configuration may result in coupling from digital outputs to analog inputs and degrade performance. All digital output traces to the receiver [such as a field-programmable gate array (FPGA) or an application-specific integrated circuit (ASIC)] should be matched in length to avoid skew among outputs.
  • At each power-supply pin (AVDD and DVDD), a 0.1-µF decoupling capacitor should be kept close to the device. A separate decoupling capacitor group consisting of a parallel combination of 10-µF, 1-µF, and 0.1-µF capacitors can be kept close to the supply source.