SBAS843A september   2017  – july 2023 ADS8588H

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: CONVST Control
    7. 6.7  Timing Requirements: Data Read Operation
    8. 6.8  Timing Requirements: Parallel Data Read Operation, CS and RD Tied Together
    9. 6.9  Timing Requirements: Parallel Data Read Operation, CS and RD Separate
    10. 6.10 Timing Requirements: Serial Data Read Operation
    11. 6.11 Timing Requirements: Byte Mode Data Read Operation
    12. 6.12 Timing Requirements: Oversampling Mode
    13. 6.13 Timing Requirements: Exit Standby Mode
    14. 6.14 Timing Requirements: Exit Shutdown Mode
    15. 6.15 Switching Characteristics: CONVST Control
    16. 6.16 Switching Characteristics: Parallel Data Read Operation, CS and RD Tied Together
    17. 6.17 Switching Characteristics: Parallel Data Read Operation, CS and RD Separate
    18. 6.18 Switching Characteristics: Serial Data Read Operation
    19. 6.19 Switching Characteristics: Byte Mode Data Read Operation
    20. 6.20 Timing Diagrams
    21. 6.21 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Inputs
      2. 7.3.2  Analog Input Impedance
      3. 7.3.3  Input Clamp Protection Circuit
      4. 7.3.4  Programmable Gain Amplifier (PGA)
      5. 7.3.5  Third-Order, Low-Pass Filter (LPF)
      6. 7.3.6  ADC Driver
      7. 7.3.7  Digital Filter and Noise
      8. 7.3.8  Reference
        1. 7.3.8.1 Internal Reference
        2. 7.3.8.2 External Reference
        3. 7.3.8.3 Supplying One VREF to Multiple Devices
      9. 7.3.9  ADC Transfer Function
      10. 7.3.10 ADS8588H Device Family Comparison
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Interface: Pin Description
        1. 7.4.1.1  REFSEL (Input)
        2. 7.4.1.2  RANGE (Input)
        3. 7.4.1.3  STBY (Input)
        4. 7.4.1.4  PAR/SER/BYTE SEL (Input)
        5. 7.4.1.5  CONVSTA, CONVSTB (Input)
        6. 7.4.1.6  RESET (Input)
        7. 7.4.1.7  RD/SCLK (Input)
        8. 7.4.1.8  CS (Input)
        9. 7.4.1.9  OS[2:0]
        10. 7.4.1.10 BUSY (Output)
        11. 7.4.1.11 FRSTDATA (Output)
        12. 7.4.1.12 DB15/BYTE SEL
        13. 7.4.1.13 DB14/HBEN
        14. 7.4.1.14 DB[13:9]
        15. 7.4.1.15 DB8/DOUTB
        16. 7.4.1.16 DB7/DOUTA
        17. 7.4.1.17 DB[6:0]
      2. 7.4.2 Device Modes of Operation
        1. 7.4.2.1 Power-Down Modes
          1. 7.4.2.1.1 Standby Mode
          2. 7.4.2.1.2 Shutdown Mode
        2. 7.4.2.2 Conversion Control
          1. 7.4.2.2.1 Simultaneous Sampling on All Input Channels
          2. 7.4.2.2.2 Simultaneous Sampling Two Sets of Input Channels
        3. 7.4.2.3 Data Read Operation
          1. 7.4.2.3.1 Parallel Data Read
          2. 7.4.2.3.2 Parallel Byte Data Read
          3. 7.4.2.3.3 Serial Data Read
          4. 7.4.2.3.4 Data Read During Conversion
        4. 7.4.2.4 Oversampling Mode of Operation
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Switching Characteristics: Serial Data Read Operation

minimum and maximum specifications are at TA = –40°C to +125°C, typical specifications are at TA = 25°C; AVDD = 5 V, 2.3 V ≤ DVDD ≤ 5.25 V, VREF = 2.5 V (internal), load on DOUTA, DOUTB, and FRSTDATA = 20 pF, VIL and VIH at specified limits, and fSAMPLE = 500 kSPS (unless otherwise noted) (see Figure 6-5)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
tD_CSDODelay time: CS falling edge to DOUTA, DOUTB enable
(out of tri-state)
12ns
tD_CKDODelay time: SCLK rising edge to valid data on DOUTA, DOUTB15ns
tDZ_CSDODelay time: CS rising edge to DOUTA, DOUTB going to tri-state12ns
tD_CSFDDelay time: CS falling edge to FRSTDATA from tri-state to high or low10ns
tDZ_CKFDDelay time: 16th SCLK falling edge to FRSTDATA falling edge15ns
tDHZ_CSFDDelay time: CS rising edge to FRSTDATA going to tri-state10ns