Refer to the PDF data sheet for device specific package drawings
The Thermal Design Guide for DSP and Arm Application Processors Application Report and the AM572x Thermal Considerations Application Report provide guidance for successful implementation of a thermal solution for system designs that contain an AM57xx application processor. They provide background information on common terms and methods related to thermal solutions. Test data and thermal calculations are also provided for a sample design. TI supports only designs that follow the system design guidelines contained in the application reports. Devices must be operated within their rated temperature ranges at all times to maintain proper function and rated Power On Hours.