SBASAZ3 October   2025 AMC0306M25-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information (D Package)
    5. 6.5  Thermal Information (DWV Package)
    6. 6.6  Power Ratings 
    7. 6.7  Insulation Specifications (Basic Isolation)
    8. 6.8  Insulation Specifications (Reinforced Isolation)
    9. 6.9  Safety-Related Certifications (Basic Isolation)
    10. 6.10 Safety-Related Certifications (Reinforced Isolation)
    11. 6.11 Safety Limiting Values (D Package)
    12. 6.12 Safety Limiting Values (DWV Package)
    13. 6.13 Electrical Characteristics
    14. 6.14 Switching Characteristics
    15. 6.15 Timing Diagrams
    16. 6.16 Insulation Characteristics Curves
    17. 6.17 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Modulator
      3. 7.3.3 Isolation Channel Signal Transmission
      4. 7.3.4 Digital Output
        1. 7.3.4.1 Output Behavior in Case of a Full-Scale Input
        2. 7.3.4.2 Output Behavior in Case of a Missing High-Side Supply
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Filter Design
        2. 8.2.2.2 Bitstream Filtering
      3. 8.2.3 Application Curve
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWV|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.2 Modulator

Figure 7-2 conceptualizes the second-order, switched-capacitor, feed-forward ΔΣ modulator implemented in the AMC0x06M25-Q1. The output V5 of the 1-bit, digital-to-analog converter (DAC) is subtracted from the input voltage VIN = (VINP – VINN). This subtraction provides an analog voltage V1 at the input of the first integrator stage. The output of the first integrator feeds the input of the second integrator stage. The result of the second integration is an output voltage V3 that is summed with VIN and the V2 output. VIN is the input signal and V2 is the first integrator. Depending on the value of the resulting voltage V4, the output of the comparator is changed. In this case, the 1-bit DAC responds on the next clock pulse by changing the associated analog output voltage V5. Thus, causing the integrators to progress in the opposite direction and forcing the integrator output value to track the average value of the input.

AMC0206M25-Q1 AMC0306M25-Q1 Block Diagram of the Second-Order Modulator Figure 7-2 Block Diagram of the Second-Order Modulator

For reduced offset and offset drift, the integrators are chopper-stabilized with the chopping frequency set at fCLKIN / 16. Figure 7-3 shows the spur at 1.25MHz that is generated by the chopping frequency for a modulator clock of 20MHz.

AMC0206M25-Q1 AMC0306M25-Q1 Quantization Noise Shaping
sinc3 filter, OSR = 1, fCLKIN = 20MHz, fIN = 1kHz
Figure 7-3 Quantization Noise Shaping