SBOS948F February   2019  – May 2021 BUF634A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: Wide-Bandwidth Mode
    6. 7.6 Electrical Characteristics: Low-Quiescent Current Mode
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Output Current
      2. 8.3.2 Thermal Shutdown
      3. 8.3.3 ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Adjustable Bandwidth
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 High-Frequency Applications
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Dissipation and Thermal Considerations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 SOIC Layout Guidelines (D Package Without a Thermal Pad)
      2. 11.1.2 HSOIC Layout Guidelines (DDA Package With a Thermal Pad)
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 TINA-TI (Free Software Download)
        2. 12.1.2.2 TI Precision Designs
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DDA|8
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1.1 High-Frequency Applications

The excellent bandwidth and fast slew rate of the BUF634A are useful in a variety of high-frequency, open-loop applications. When operated in an open-loop application, printed circuit board (PCB) layout and bypassing techniques can affect dynamic performance. Figure 9-2 through Figure 9-6 illustrate various application circuit examples for the BUF634A.

For best results, use a ground-plane-type circuit board layout and bypass the power supplies with 0.1-µF ceramic chip capacitors at the device pins in parallel with solid tantalum 10-µF capacitors. Source resistance affects high-frequency peaking, step-response overshoot, and ringing. Best response is usually achieved with a series input resistor of 25 Ω to 200 Ω, depending on the signal source. Response with some loads (especially capacitive) can be improved with a resistor of 10 Ω to 150 Ω in series with the output. When driving multiple device under test (DUT) inputs in automatic test equipment (ATE) testers (large capacitive load), as illustrated in Figure 9-3, place an isolation resistor at the output of the BUF634A for adequate phase margin and stability.

GUID-AEBA4C98-7C78-4C98-90F1-B2F087734CAA-low.gif Figure 9-2 High-Performance Headphone Driver
GUID-E9240DF4-EF80-4A19-89A9-64D5A1E43717-low.gifFigure 9-3 ATE and Test Pin Driver
GUID-6AF5292B-FD4C-45C1-A405-A0F12B8332A6-low.gifFigure 9-4 Pseudo-Ground Driver
GUID-424A22B2-58F0-47BE-93ED-9189508FC429-low.gif Figure 9-5 Current-Output Valve Driver
GUID-FF520851-64DC-4DED-B9DB-6EE0372BF67D-low.gifFigure 9-6 Bridge-Connected Motor Driver