SBOS948F February   2019  – May 2021 BUF634A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: Wide-Bandwidth Mode
    6. 7.6 Electrical Characteristics: Low-Quiescent Current Mode
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Output Current
      2. 8.3.2 Thermal Shutdown
      3. 8.3.3 ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Adjustable Bandwidth
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 High-Frequency Applications
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Dissipation and Thermal Considerations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 SOIC Layout Guidelines (D Package Without a Thermal Pad)
      2. 11.1.2 HSOIC Layout Guidelines (DDA Package With a Thermal Pad)
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 TINA-TI (Free Software Download)
        2. 12.1.2.2 TI Precision Designs
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DDA|8
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.1 Output Current

The BUF634A can deliver up to ±250-mA continuous output current. Internal circuitry limits the output current to approximately ±350 mA. Care must be taken to limit the output voltage swing for a given load resistance to avoid limiting the output current and degrading linearity; see Figure 9-8. For many applications, however, the continuous output current is limited by thermal effects. The output voltage swing capability varies with junction temperature and output current; see Figure 7-17 and Figure 7-18. Care must be taken to operate the device below the maximum-recommended junction temperature in applications using this buffer in wide-bandwidth mode with a wide supply voltage and large output current to avoid permanent damage to the device.