SWRS205E March   2017  – May 2021 CC3120MOD

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagrams
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 CC3120MOD Pin Diagram
    2. 7.2 Pin Attributes
      1.      11
    3. 7.3 Connections for Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption Summary
    5. 8.5  TX Power and IBAT versus TX Power Level Settings
    6. 8.6  Brownout and Blackout Conditions
    7. 8.7  Electrical Characteristics
    8. 8.8  WLAN Receiver Characteristics
    9. 8.9  WLAN Transmitter Characteristics
    10. 8.10 Reset Requirement
    11. 8.11 Thermal Resistance Characteristics for MOB Package
    12. 8.12 Timing and Switching Characteristics
      1. 8.12.1 Power-Up Sequencing
      2. 8.12.2 Power-Down Sequencing
      3. 8.12.3 Device Reset
      4. 8.12.4 Wakeup From HIBERNATE Mode Timing
    13. 8.13 External Interfaces
      1. 8.13.1 SPI Host Interface
      2. 8.13.2 Host UART Interface
        1. 8.13.2.1 5-Wire UART Topology
        2. 8.13.2.2 4-Wire UART Topology
        3. 8.13.2.3 3-Wire UART Topology
      3. 8.13.3 External Flash Interface
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Module Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
        1. 9.2.2.1 Security
      3. 9.2.3 Host Interface and Driver
      4. 9.2.4 System
    3. 9.3 Power-Management Subsystem
      1. 9.3.1 VBAT Wide-Voltage Connection
    4. 9.4 Low-Power Operating Modes
      1. 9.4.1 Low-Power Deep Sleep
      2. 9.4.2 Hibernate
      3. 9.4.3 Shutdown
    5. 9.5 Restoring Factory Default Configuration
    6. 9.6 Device Certification and Qualification
      1. 9.6.1 FCC Certification and Statement
      2. 9.6.2 Industry Canada (IC) Certification and Statement
      3. 9.6.3 ETSI/CE Certification
      4. 9.6.4 Japan MIC Certification
      5. 9.6.5 SRRC Certification and Statement
    7. 9.7 Module Markings
    8. 9.8 End Product Labeling
    9. 9.9 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
      2. 10.1.2 Power Supply Decoupling and Bulk Capacitors
      3. 10.1.3 Reset
      4. 10.1.4 Unused Pins
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General Layout Recommendations
      2. 10.2.2 RF Layout Recommendations
      3. 10.2.3 Antenna Placement and Routing
      4. 10.2.4 Transmission Line Considerations
  11. 11Environmental Requirements and Specifications
    1. 11.1 Temperature
      1. 11.1.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 Baking Conditions
    5. 11.5 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Development Tools and Software
    3. 12.3 Firmware Updates
    4. 12.4 Documentation Support
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
    3. 13.3 Tape and Reel Information
      1. 13.3.1 Tape and Reel Specification

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOB|63
Thermal pad, mechanical data (Package|Pins)

9.2.2 Network Stack

The network stack features are as follows:

  • Integrated IPv4, IPv6, and TCP/IP stack with BSD socket APIs for simple Internet connectivity with any MCU, microprocessor, or ASIC
    Note:

    Not all APIs are 100% BSD compliant. Not all BSD APIs are supported.

  • Support of 16 simultaneous TCP, UDP, or RAW sockets
  • Support of 6 simultaneous SSL\TLS sockets
  • Built-in network protocols:
    • Static IP, LLA, DHCPv4, DHCPv6 (Stateful) with DAD and Stateless auto configuration
    • ARP, ICMPv4, IGMP, ICMPv6, MLD, ND
    • DNS client for easy connection to the local network and the Internet
  • Built-in network application and utilities:
    • HTTP/HTTPS
      • Web page content stored on serial Flash
      • RESTful APIs for setting and configuring application content
      • Dynamic user callbacks
  • Service discovery: Multicast DNS service discovery allows a client to advertise its service without a centralized server. After connecting to the access point, the CC3120 device provides critical information, such as device name, IP, vendor, and port number.
  • DHCP server
  • Ping

Table 9-1 summarizes the NWP features.

Table 9-1 NWP Features
FEATURES DESCRIPTION
Wi-Fi standards 802.11b/g/n station
802.11b/g AP supporting up to four stations
Wi-Fi Direct client and group owner
Wi-Fi Channels 1 to 13
Wi-Fi security WEP, WPA/WPA2 PSK, WPA2 enterprise (802.1x), WPA3 personal and enterprise
Wi-Fi provisioning SmartConfig technology, Wi-Fi protected setup (WPS2), AP mode with internal HTTP/HTTPS web server
IP protocols IPv4 and IPv6
IP addressing Static IP, LLA, DHCPv4, DHCPv6 (Stateful) with DAD and stateless auto configuration
Cross layer ARP, ICMPv4, IGMP, ICMPv6, MLD, NDP
Transport UDP, TCP
SSLv3.0/TLSv1.0/TLSv1.1/TLSv1.2
RAW IP
Network applications and utilities Ping
HTTP/HTTPS web server
mDNS
DNS-SD
DHCP server
Host interface UART/SPI
Security Secure file system
Unique ID and private key for device authentication
Crypto utilities
Secure content delivery
Power management Enhanced power policy management uses 802.11 power save and deep sleep power modes
Other RF Transceiver
Programmable RX Filters with Events trigger mechanism including WoWLAN
Recovery mechanism – Restore to factory default