SLASF61A January   2023  – September 2023 DAC539G2-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Voltage Output
    6. 6.6  Electrical Characteristics: Comparator Mode
    7. 6.7  Electrical Characteristics: General
    8. 6.8  Timing Requirements: I2C Standard Mode
    9. 6.9  Timing Requirements: I2C Fast Mode
    10. 6.10 Timing Requirements: I2C Fast Mode Plus
    11. 6.11 Timing Requirements: SPI Write Operation
    12. 6.12 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)
    13. 6.13 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)
    14. 6.14 Timing Requirements: GPIO
    15. 6.15 Timing Diagrams
    16. 6.16 Typical Characteristics: Voltage Output
    17. 6.17 Typical Characteristics: Comparator
    18. 6.18 Typical Characteristics: General
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Smart Digital-to-Analog Converter (DAC) Architecture
      2. 7.3.2 Programming Interface
      3. 7.3.3 Nonvolatile Memory (NVM)
    4. 7.4 Device Functional Modes
      1. 7.4.1 GPI-to-Voltage Converter
        1. 7.4.1.1 Voltage Reference and DAC Transfer Function
        2. 7.4.1.2 Power-Supply as Reference
        3. 7.4.1.3 Internal Reference
        4. 7.4.1.4 External Reference
      2. 7.4.2 Voltage-to-PWM Converter
        1. 7.4.2.1 Function Generation
          1. 7.4.2.1.1 Triangular Waveform Generation
          2. 7.4.2.1.2 Sawtooth Waveform Generation
          3. 7.4.2.1.3 PWM Frequency Correction
      3. 7.4.3 Device Reset and Fault Management
        1. 7.4.3.1 Power-On Reset (POR)
        2. 7.4.3.2 External Reset
        3. 7.4.3.3 Register-Map Lock
        4. 7.4.3.4 NVM Cyclic Redundancy Check (CRC)
          1. 7.4.3.4.1 NVM-CRC-FAIL-USER Bit
          2. 7.4.3.4.2 NVM-CRC-FAIL-INT Bit
      4. 7.4.4 Power-Down Mode
    5. 7.5 Programming
      1. 7.5.1 SPI Programming Mode
      2. 7.5.2 I2C Programming Mode
        1. 7.5.2.1 F/S Mode Protocol
        2. 7.5.2.2 I2C Update Sequence
          1. 7.5.2.2.1 Address Byte
          2. 7.5.2.2.2 Command Byte
        3. 7.5.2.3 I2C Read Sequence
    6. 7.6 Register Maps
      1. 7.6.1  NOP Register (address = 00h) [reset = 0000h]
      2. 7.6.2  DAC-X-VOUT-CMP-CONFIG Register (address = 15h, 03h) [reset = 0400h]
      3. 7.6.3  COMMON-CONFIG Register (address = 1Fh) [reset = 03F9h]
      4. 7.6.4  COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
      5. 7.6.5  FUNCTION-TRIGGER Register (address = 21h) [reset = 0001h]
      6. 7.6.6  GENERAL-STATUS Register (address = 22h) [reset = 2068h]
      7. 7.6.7  DEVICE-MODE-CONFIG Register (address = 25h) [reset = 8040h]
      8. 7.6.8  INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
      9. 7.6.9  STATE-MACHINE-CONFIG Register (address = 27h) [reset = 0003h]
      10. 7.6.10 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
      11. 7.6.11 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
      12. 7.6.12 FUNCTION-CONFIG Register (SRAM address = 20h) [reset = 007Ah]
      13. 7.6.13 FUNCTION-MAX Register (SRAM address = 21h) [reset = B900h]
      14. 7.6.14 FUNCTION-MIN Register (SRAM address = 22h) [reset = 1900h]
      15. 7.6.15 GPI-DEBOUNCE Register (SRAM address = 23h) [reset = 0138h]
      16. 7.6.16 VOUT-DATA-X Register (SRAM address = 24h to 2Bh) [reset = see #GUID-D64978E3-E8F0-4408-A2C1-8C72D24777EC/X6961 ]
      17. 7.6.17 PWM-FREQUENCY-ERROR Register (SRAM address = 9Eh) [reset = device-specific]
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics: Voltage Output

at TA = 25°C, VDD = 5.5 V, external reference = 5.5 V, gain = 1 ×, and DAC outputs unloaded (unless otherwise noted)

GUID-20230126-SS0I-QLNN-DBKC-JJHPPRPC6XH9-low.svg
Internal reference, gain = 4 ×
Figure 6-4 Voltage Output INL vs Digital Input Code
GUID-20230126-SS0I-4WZQ-0CKG-N03Q5VWRGZNS-low.svg
 
Figure 6-6 Voltage Output INL vs Temperature
GUID-20230126-SS0I-1DQ8-4XFN-RLWRFCTH7F7Z-low.svg
Internal reference, gain = 4 ×
Figure 6-8 Voltage Output DNL vs Digital Input Code
GUID-20230126-SS0I-KLMC-BPSL-WLK8LL0VD6NK-low.svg
 
Figure 6-10 Voltage Output DNL vs Temperature
GUID-20230126-SS0I-L3HQ-DS2S-S0F43BKXPK1L-low.svg
Internal reference, gain = 4 ×
Figure 6-12 Voltage Output TUE vs Digital Input Code
GUID-20220410-SS0I-HL85-XWZD-X3DHT7824VLT-low.svg
DAC channels at midscale
Figure 6-14 Voltage Output TUE vs Temperature
GUID-20220410-SS0I-VRN3-DSBQ-4ZJ4TSPRDTWS-low.svg
 
Figure 6-16 Voltage Output Offset Error vs Temperature
GUID-20220410-SS0I-RCS9-Z0SB-C7XS371JFDCB-low.svg
DAC channels at midscale
Figure 6-18 Voltage Output vs Load Current
GUID-20230126-SS0I-7WW1-HBF2-TSNBKVFW1MVP-low.svg
 
Figure 6-20 Voltage Output Code-to-Code Glitch - Rising Edge
GUID-20220410-SS0I-P6RZ-WCS0-TH4H7GDGR4GT-low.svg
Zero scale to full scale swing 
Figure 6-22 Voltage Output Setting Time - Rising Edge
GUID-20220410-SS0I-HWHM-QTB2-HCZF9CZPB39X-low.svg
DAC in Hi-Z power-down mode
Figure 6-24 Voltage Output Power-On Glitch
GUID-20220410-SS0I-CG68-XTL7-MDGLNLDQMQKZ-low.svg
Internal reference, gain = 4 ×
Figure 6-26 Voltage Output Noise Density
GUID-20220410-SS0I-9PTT-1N7B-NSSN0MRDPJ8Z-low.svg
Internal reference, gain = 4x, f = 0.1 Hz to 10 Hz
Figure 6-28 Voltage Output Flicker Noise
GUID-20230126-SS0I-VL8Z-PXHX-6C8VNK8GLH3C-low.svg
 
Figure 6-5 Voltage Output INL vs Digital Input Code
GUID-20230126-SS0I-43CR-PGPC-JFFBC8KTWTLD-low.svg
 
Figure 6-7 Voltage Output INL vs Supply Voltage
GUID-20230126-SS0I-4WHS-Z09L-DHQGDQLBT7DP-low.svg
 
Figure 6-9 Voltage Output DNL vs Digital Input Code
GUID-20230126-SS0I-PTHL-DSDM-GLNBH5PGH1WN-low.svg
 
Figure 6-11 Voltage Output DNL vs Supply Voltage
GUID-20230126-SS0I-9F3K-LB85-S4KPMXGC2RRS-low.svg
 
Figure 6-13 Voltage Output TUE vs Digital Input Code
GUID-20220410-SS0I-7P3Z-XZ4M-JW1KSGKKCPRW-low.svg
DAC channels at midscale
Figure 6-15 Voltage Output TUE vs Supply Voltage
GUID-20220410-SS0I-SW9H-W36R-4CJVPBNR12GD-low.svg
 
Figure 6-17 Voltage Output Gain Error vs Temperature
GUID-20220410-SS0I-JVXQ-PZT4-WB6F2NVHQWR8-low.svg
 
Figure 6-19 Voltage Output AC PSRR vs Frequency
GUID-20230126-SS0I-2RJQ-3H80-DJSWZWK8GTQF-low.svg
 
Figure 6-21 Voltage Output Code-to-Code Glitch - Falling Edge
GUID-20220410-SS0I-9TH4-GTX4-BT0DZTK5H5G5-low.svg
Full scale to zero scale swing
Figure 6-23 Voltage Output Setting Time - Falling Edge
GUID-20220410-SS0I-XFFT-CQ3W-H4BNPNG6G8WC-low.svg
DAC at zero scale 
Figure 6-25 Voltage Output Power-Off Glitch
GUID-20220410-SS0I-GVRF-VW2W-0KSMJHT8DP0G-low.svg
 
Figure 6-27 Voltage Output Noise Density
GUID-20220410-SS0I-XQMG-WLWC-ZJ78JSHHHHV3-low.svg
f = 0.1 Hz to 10 Hz 
Figure 6-29 Voltage Output Flicker Noise