DLPS167A March 2024 – September 2024 DLPC964
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
The PCB layer design may vary depending on the system design. However, careful attention is required to meet design considerations. Table 7-13 shows a layer definition table and Figure 7-14 shows a PCB stack-up. The PCB stack-up uses Nelco N4000-13-SI as the dielectric material to improve the signal slew rate for better performance of the Aurora 64B/66B input interface and the HSSI DMD output interface.
| LAYER | DESCRIPTION |
|---|---|
| Top | Top components. Low frequency signals routing, ground, voltage mini-planes |
| 2 | Ground |
| 3 | High speed signal layer |
| 4 | Ground |
| 5 | Split power plane |
| 6 | Split power plane |
| 7 | Ground |
| 8 | High speed signal layer |
| 9 | Ground |
| Bottom | Discrete components. Low frequency signals routing, ground, voltage mini-planes |
Figure 7-14 PCB Stack-Up.