SLOS916B June   2016  – June 2020 DRV2511-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input and Configurable Pre-amplifier
      2. 7.3.2 Pulse-Width Modulator (PWM)
      3. 7.3.3 Designed for low EMI
      4. 7.3.4 Device Protection Systems
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation in Shutdown Mode
      2. 7.4.2 Operation in Standby Mode
      3. 7.4.3 Operation in Active Mode
  8. 8 Programming
    1. 8.1 Gain
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application, Single Ended Input
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Optional Components
        2. 9.2.2.2 Capacitor Selection
        3. 9.2.2.3 Solenoid Selection
        4. 9.2.2.4 Output Filter Considerations
      3. 9.2.3 Application Curves
      4. 9.2.4 Typical Application, Differential Input
  10. 10Power Supply Recommendations
    1. 10.1 Power Dissipation and Maximum Ambient Temperature
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

DAP Package
32-PIN HTSSOP
Top View
DRV2511-Q1 tssop_slos916.gif

Pin Functions

PIN TYPE(1) DESCRIPTION
NAME NO.
GND 1, 9, 10, 11, 22, 25, 28 P Ground.
EN 2 I Device enable pin.
INTZ 3 O General fault reporting. Open drain.
INTZ = High, normal operation
INTZ = Low, fault condition
IN+ 4 I Positive differential input.
IN- 5 I Negative differential input.
REG 6, 7 P Internally generated gate voltage supply. Not to be used as a supply or connected to any component other than a 1 µF X7R ceramic decoupling capacitor and the GAIN resistor divider.
GAIN 8 I Selects Gain.
STDBY 12 I Standby pin.
FS2 13 I Output switching frequency selection.
FS1 14 I Output switching frequency selection.
FS0 15 I Output switching frequency selection.
N/C 16 N/C Pin should be left floating.
AVDD 17 P Analog Supply, can be connected to VBAT for single power supply operation.
PVDD 18, 19, 31, 32 P Power supply.
BSTN 20, 24 P Boot strap for negative output, connect to 220 nF X5R, or better ceramic cap to OUT-.
OUT- 21, 23 O Negative output
BSTP 26, 30 P Boot strap for positive output, connect to 220 nF X5R, or better ceramic cap to OUT+.
OUT+ 27, 29 O Positive output.
Thermal Pad or
PowerPAD™		 G Connect to GND for best system performance. If not connected to GND, leave floating.
(1) DO = Digital Output, DI = Digital Input, AI = Analog Input, O = Amplifier Output, G = General Ground, P = Power, BST = Boot Strap.