SLOS751D March   2013  – November 2018 DRV2667

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Support for Haptic Piezo Actuators
      2. 7.3.2  Flexible Front End Interface
      3. 7.3.3  Ramp Down Behavior
      4. 7.3.4  Low Latency Startup
      5. 7.3.5  Low Power Standby Mode
      6. 7.3.6  Device Reset
      7. 7.3.7  Amplifier Gain
      8. 7.3.8  Adjustable Boost Voltage
      9. 7.3.9  Adjustable Current Limit
      10. 7.3.10 Internal Charge Pump
      11. 7.3.11 Device Protection
        1. 7.3.11.1 Thermal Protection
        2. 7.3.11.2 Overcurrent Protection
        3. 7.3.11.3 Brownout Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 FIFO Mode
        1. 7.4.1.1 Waveform Timeout
      2. 7.4.2 Direct Playback from RAM Mode
      3. 7.4.3 Waveform Synthesis Playback Mode
      4. 7.4.4 Waveform Sequencer
      5. 7.4.5 Analog Playback Mode
      6. 7.4.6 Low Voltage Operation Mode
    5. 7.5 Programming
      1. 7.5.1 Programming the Boost Voltage
      2. 7.5.2 Programming the Boost Current Limit
      3. 7.5.3 Programming the RAM
        1. 7.5.3.1 Accessing the RAM
        2. 7.5.3.2 RAM Format
          1. 7.5.3.2.1 Programming the Waveform Sequencer
      4. 7.5.4 I2C Interface
        1. 7.5.4.1 General I2C Operation
        2. 7.5.4.2 Single-Byte and Multiple-Byte Transfers
        3. 7.5.4.3 Single-Byte Write
        4. 7.5.4.4 Multiple-Byte Write and Incremental Multiple-Byte Write
        5. 7.5.4.5 Single-Byte Read
        6. 7.5.4.6 Multiple-Byte Read
    6. 7.6 Register Map
      1. 7.6.1  Address: 0x00
        1. Table 5. Address: 0x00
      2. 7.6.2  Address: 0x01
        1. Table 6. Address: 0x01
      3. 7.6.3  Address: 0x02
        1. Table 7. Address: 0x02
      4. 7.6.4  Address: 0x03
        1. Table 8. Address: 0x03
      5. 7.6.5  Address: 0x04
        1. Table 9. Address: 0x04
      6. 7.6.6  Address: 0x05
        1. Table 10. Address: 0x05
      7. 7.6.7  Address: 0x06
        1. Table 11. Address: 0x06
      8. 7.6.8  Address: 0x07
        1. Table 12. Address: 0x07
      9. 7.6.9  Address: 0x08
        1. Table 13. Address: 0x08
      10. 7.6.10 Address: 0x09
        1. Table 14. Address: 0x09
      11. 7.6.11 Address: 0x0A
        1. Table 15. Address: 0x0A
      12. 7.6.12 Address: 0x0B
        1. Table 16. Address: 0x0B
      13. 7.6.13 Address: 0xFF
        1. Table 17. Address: 0xFF
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Piezo Actuator Selection
        3. 8.2.2.3 Boost Capacitor Selection
        4. 8.2.2.4 Bulk Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Initialization Setup
      1. 8.3.1 Initialization Procedure
      2. 8.3.2 Typical Usage Examples
        1. 8.3.2.1 Single Click or Alert Example
        2. 8.3.2.2 Library Storage Example
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Direct Playback from RAM Mode

The Direct Playback from RAM mode makes use of the on-chip 2 kB of RAM for internal waveform storage. This mode allows for immediate, low-latency recall of arbitrary haptic waveforms with very little intervention from the host processor. Haptic waveforms, be they simple or complex, may be stored in this memory at opportune times when immediate processor response is not critical. Examples of this are when the end-user product is being powered up and initialized or when an application is being launched.

The waveforms are stored as 8-bit twos-complement, Nyquist-rate data points, and are played from RAM at an 8-kHz data rate. Up to 250 ms of total waveform playback time may be stored in the Direct Playback From RAM mode format in the 2-kB memory. The waveform sizes are completely customizable, so many small waveforms may be stored or fewer long ones. The sum of the waveform lengths must not be greater than the 2-kB RAM size.