SNLS582C June   2017  – September 2020 FPC402

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Host-Side Control Interface
      2. 8.3.2  LED Control
      3. 8.3.3  Low-Speed Output Signal Control
      4. 8.3.4  Low-Speed Input Status and Interrupt Generation
      5. 8.3.5  Downstream (Port-Side) I2C Master
      6. 8.3.6  Data Prefetch From Modules
      7. 8.3.7  Scheduled Write
      8. 8.3.8  Protocol Timeouts
      9. 8.3.9  General-Purpose Inputs and Outputs
      10. 8.3.10 Hot-Plug Support
    4. 8.4 Device Functional Modes
      1. 8.4.1 I2C Host-Side Control Interface
      2. 8.4.2 SPI Host-Side Control Interface
        1. 8.4.2.1 SPI Frame Structure
        2. 8.4.2.2 SPI Read Operation
        3. 8.4.2.3 SPI Write Operation
    5. 8.5 Programming
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 SFP/QSFP Port Management
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Sequencing
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Recommended Package Footprint
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.6 Glossary

    TI Glossary This glossary lists and explains terms, acronyms, and definitions.