SLLSFG4F December   2019  – June 2024 ISO6740-Q1 , ISO6741-Q1 , ISO6742-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics—5-V Supply
    10. 5.10 Supply Current Characteristics—5-V Supply
    11. 5.11 Electrical Characteristics—3.3-V Supply
    12. 5.12 Supply Current Characteristics—3.3-V Supply
    13. 5.13 Electrical Characteristics—2.5-V Supply 
    14. 5.14 Supply Current Characteristics—2.5-V Supply
    15. 5.15 Electrical Characteristics—1.8-V Supply
    16. 5.16 Supply Current Characteristics—1.8-V Supply
    17. 5.17 Switching Characteristics—5-V Supply
    18. 5.18 Switching Characteristics—3.3-V Supply
    19. 5.19 Switching Characteristics—2.5-V Supply
    20. 5.20 Switching Characteristics—1.8-V Supply
    21. 5.21 Insulation Characteristics Curves
    22. 5.22 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
        1. 8.2.3.1 Insulation Lifetime
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PCB Material
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The ISO674x-Q1 devices are high-performance, quad-channel digital isolators designed for cost-sensitive applications requiring up to 5000VRMS isolation ratings per UL 1577. These devices are also certified by VDE, TUV, CSA, and CQC.

The ISO674x-Q1 devices provide high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by TI's double capacitive silicon dioxide (SiO2) insulation barrier. These devices come with enable pins which can be used to put the respective outputs in high impedance for multi-controller driving applications. The ISO6740-Q1 device has all four channels in the same direction, the ISO6741-Q1 device has three forward and one reverse-direction channels, and the ISO6742-Q1 device has two forward and two reverse-direction channels. In the event of input power or signal loss, the default output is high for devices without suffix F and low for devices with suffix F. See also Device Functional Modes section.

Used in conjunction with isolated power supplies, the ISO674x-Q1 devices help prevent noise currents on data buses, such as CAN and LIN from damaging sensitive circuitry. Through remarkable chip design and layout techniques, the electromagnetic compatibility of the ISO674x-Q1 devices has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. The ISO674x-Q1 family of devices is available in a 16-pin SOIC wide-body (DW) package and is a pin-to-pin upgrade to the older generations.

Package Information
PART NUMBER PACKAGE(1) BODY SIZE (NOM) PACKAGE SIZE(2)
ISO6740-Q1, ISO6740F-Q1

ISO6741-Q1, ISO6741F-Q1

ISO6742-Q1, ISO6742F-Q1

DW (SOIC, 16) 10.30mm × 7.50mm 10.30mm × 10.30mm
ISO6742-Q1, ISO6742F-Q1 DWW (Extra wide SOIC, 16)(3) 10.30mm × 14.0mm 10.30mm × 17.25mm
For more information, see Section 11.
The package size (length × width) is a nominal value and includes pins, where applicable.
Product preview.
ISO6740-Q1 ISO6741-Q1 ISO6742-Q1 Simplified Schematic

VCCI=Input supply, VCCO=Output supply
GNDI=Input ground, GNDO=Output ground

Simplified Schematic