SWRS219F October   2018  – April 2025 IWR6443 , IWR6843

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
    1. 5.1 Related Products
  7. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Signal Descriptions
      1. 6.2.1 Signal Descriptions - Digital
      2. 6.2.2 Signal Descriptions - Analog
    3. 6.3 Pin Attributes
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.5.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.5.2 Hardware Requirements
      3. 7.5.3 Impact to Your Hardware Warranty
    6. 7.6  Power Supply Specifications
    7. 7.7  Power Consumption Summary
    8. 7.8  Power Save Mode
    9. 7.9  RF Specification
    10. 7.10 CPU Specifications
    11. 7.11 Thermal Resistance Characteristics for FCBGA Package [ABL0161]
    12. 7.12 Timing and Switching Characteristics
      1. 7.12.1  Power Supply Sequencing and Reset Timing
      2. 7.12.2  Input Clocks and Oscillators
        1. 7.12.2.1 Clock Specifications
      3. 7.12.3  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 7.12.3.1 Peripheral Description
        2. 7.12.3.2 MibSPI Transmit and Receive RAM Organization
          1. 7.12.3.2.1 SPI Timing Conditions
          2. 7.12.3.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input) #GUID-C70CFB1F-161A-495B-85B8-62E1C643D037/T4362547-236 #GUID-C70CFB1F-161A-495B-85B8-62E1C643D037/T4362547-237 #GUID-C70CFB1F-161A-495B-85B8-62E1C643D037/T4362547-238
          3. 7.12.3.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input) #GUID-F724BCC6-8F26-42C4-8723-451EDE9A36D3/T4362547-244 #GUID-F724BCC6-8F26-42C4-8723-451EDE9A36D3/T4362547-245 #GUID-F724BCC6-8F26-42C4-8723-451EDE9A36D3/T4362547-246
        3. 7.12.3.3 SPI Peripheral Mode I/O Timings
          1. 7.12.3.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output) #GUID-1B5DE4C6-14B2-48EF-965D-3B03E1AE325B/T4362547-70 #GUID-1B5DE4C6-14B2-48EF-965D-3B03E1AE325B/T4362547-71 #GUID-1B5DE4C6-14B2-48EF-965D-3B03E1AE325B/T4362547-73
        4. 7.12.3.4 Typical Interface Protocol Diagram (Peripheral Mode)
      4. 7.12.4  LVDS Interface Configuration
        1. 7.12.4.1 LVDS Interface Timings
      5. 7.12.5  General-Purpose Input/Output
        1. 7.12.5.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      6. 7.12.6  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. 7.12.6.1 Dynamic Characteristics for the CANx TX and RX Pins
      7. 7.12.7  Serial Communication Interface (SCI)
        1. 7.12.7.1 SCI Timing Requirements
      8. 7.12.8  Inter-Integrated Circuit Interface (I2C)
        1. 7.12.8.1 I2C Timing Requirements #GUID-36963FBF-DA1A-4FF8-B71D-4A185830E708/T4362547-185
      9. 7.12.9  Quad Serial Peripheral Interface (QSPI)
        1. 7.12.9.1 QSPI Timing Conditions
        2. 7.12.9.2 Timing Requirements for QSPI Input (Read) Timings #GUID-6DC69BBB-F187-4499-AC42-8C006552DEE1/T4362547-210 #GUID-6DC69BBB-F187-4499-AC42-8C006552DEE1/T4362547-209
        3. 7.12.9.3 QSPI Switching Characteristics
      10. 7.12.10 ETM Trace Interface
        1. 7.12.10.1 ETMTRACE Timing Conditions
        2. 7.12.10.2 ETM TRACE Switching Characteristics
      11. 7.12.11 Data Modification Module (DMM)
        1. 7.12.11.1 DMM Timing Requirements
      12. 7.12.12 JTAG Interface
        1. 7.12.12.1 JTAG Timing Conditions
        2. 7.12.12.2 Timing Requirements for IEEE 1149.1 JTAG
        3. 7.12.12.3 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Subsystems
      1. 8.3.1 RF and Analog Subsystem
        1. 8.3.1.1 Clock Subsystem
        2. 8.3.1.2 Transmit Subsystem
        3. 8.3.1.3 Receive Subsystem
      2. 8.3.2 Processor Subsystem
      3. 8.3.3 Host Interface
      4. 8.3.4 Main Subsystem Cortex-R4F
      5. 8.3.5 DSP Subsystem
      6. 8.3.6 Hardware Accelerator
    4. 8.4 Other Subsystems
      1. 8.4.1 ADC Channels (Service) for User Application
        1. 8.4.1.1 GP-ADC Parameter
    5. 8.5 Boot Modes
      1. 8.5.1 Flashing Mode
      2. 8.5.2 Functional Mode
  10. 9 Monitoring and Diagnostics
    1. 9.1 Monitoring and Diagnostic Mechanisms
      1. 9.1.1 Error Signaling Module
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Reference Schematic
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information
    2. 13.2 Tray Information for ABL, 10.4 × 10.4 mm

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ABL|161
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Revision History

Changes from Revision E (June 2021) to Revision F (April 2025)

  • (Applications) :Application links updatedGo
  • (Device Comparison): IWRL6432 and IWRL1432 devices addedGo
  • (Signal Descriptions) :Updated/Changed CLKP and CLKM descriptionsGo
  • (VPP Specification for One-Time Programmable (OTP) eFuses): New section added.Go
  • (Power Save Mode): New section added.Go
  • (Device Wake-Up Sequence): Logic diagram updated.Go
  • (Table. Crystal Electrical Characteristics (Oscillator Mode): Updated crystal frequency tolerance to –200ppm to +200ppmGo
  • (QSPI Switching Characteristics): Updated cycle time, sclk to 12.5nsGo
  • (Boot Modes): Added Boot Modes sectionGo
  • (Monitoring and Diagnostic Mechanisms):Added Device Safety Manual noteGo

Changes from October 1, 2020 to June 30, 2021 (from Revision D (Oct 2020) to Revision E (June 2021))

  • Global: Updated to reflect Functional Safety-ComplianceGo
  • Global: Updated/Changed Master Subsystem to Main Subsystem and Master R4F to MSS R4FGo
  • Global: Updated/Changed A2D to ADCGo
  • (Features) : Updated Functional-Safety Compliance Certification CollateralGo
  • (Device Information) : Added additional Secure production parts for IWR6843Go
  • Updated/Changed Functional Block Diagram Go
  • (Device Comparison):Updated/Changed SIL row to reflect Functional Safety-Compliance for IWR6843Go
  • (Device Comparison): Added a table-note about LVDS and Non-Functional Safety Variant InformationGo
  • (Device Comparison): Updated/Changed the IWR6843AOP Product status from "AI" to "PD" Go
  • (Device Comparison): IWRL6432 and IWRL6432AOP devices addedGo
  • (Device Comparison): IWRL1432 device addedGo
  • (Device Comparison): IWRL1432 device addedGo
  • (Absolute Maximum Ratings): Added entries for externally supplied power on the RF inputs (TX and RX) and a table-note for the signal level applied on TX.Go
  • (ESD Ratings): Changed HBM ESD value from ±1000 V to ±2000 V, CDM ESD value from ±250 V to ±500 V and added footnote about corner pins.Go
  • Transmit Subsystem (Per Channel): Updated/Changed figure.Go
  • Updated/changed "Master" to "Main" in Processor Subsystem imageGo
  • (Monitoring and Diagnostic Mechanisms): Updated/Changed table header and description to reflect Functional Safety-ComplianceGo
  • (Monitoring and Diagnostic Mechanisms): Updated/Changed Master R4F to MSS R4F and Master SS to Main SSGo
  • (Device Nomenclature):Updated/changed figure to reflect Functional Safety-Compliance, SIL 2 for Safety Level BGo
  • (Tray Information for ABL, 10.4 × 10.4 mm): Added tray information for secure parts.Go