SNVS603D August   2009  – July 2019 LM3424

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Typical Boost Application Circuit
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Current Regulators
      2. 7.3.2  Peak Current Mode Control
      3. 7.3.3  Average LED Current
      4. 7.3.4  Thermal Foldback and Analog Dimming
      5. 7.3.5  Current Sense and Current Limit
      6. 7.3.6  Slope Compensation
      7. 7.3.7  Control Loop Compensation
      8. 7.3.8  Start-Up Regulator and Soft-Start
      9. 7.3.9  Overvoltage Lockout (OVLO)
      10. 7.3.10 Input Undervoltage Lockout (UVLO)
        1. 7.3.10.1 UVLO Only
        2. 7.3.10.2 PWM Dimming and UVLO
      11. 7.3.11 PWM Dimming
      12. 7.3.12 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Inductor
      2. 8.1.2 LED Dynamic Resistance
      3. 8.1.3 Output Capacitor
      4. 8.1.4 Input Capacitors
      5. 8.1.5 Main MOSFET and Dimming MOSFET
      6. 8.1.6 Re-Circulating Diode
      7. 8.1.7 Switching Frequency
    2. 8.2 Typical Applications
      1. 8.2.1 Basic Topology Schematics
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Operating Point
          2. 8.2.1.2.2  Switching Frequency
          3. 8.2.1.2.3  Average LED Current
          4. 8.2.1.2.4  Thermal Foldback
          5. 8.2.1.2.5  Inductor Ripple Current
          6. 8.2.1.2.6  LED Ripple Current
          7. 8.2.1.2.7  Peak Current Limit
          8. 8.2.1.2.8  Slope Compensation
          9. 8.2.1.2.9  Loop Compensation
          10. 8.2.1.2.10 Input Capacitance
          11. 8.2.1.2.11 NFET
          12. 8.2.1.2.12 Diode
          13. 8.2.1.2.13 Output OVLO
          14. 8.2.1.2.14 Input UVLO
          15. 8.2.1.2.15 Soft-Start
          16. 8.2.1.2.16 PWM Dimming Method
          17. 8.2.1.2.17 Analog Dimming Method
      2. 8.2.2 Buck-Boost Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1  Operating Point
          2. 8.2.2.2.2  Switching Frequency
          3. 8.2.2.2.3  Average LED Current
          4. 8.2.2.2.4  Thermal Foldback
          5. 8.2.2.2.5  Inductor Ripple Current
          6. 8.2.2.2.6  Output Capacitance
          7. 8.2.2.2.7  Peak Current Limit
          8. 8.2.2.2.8  Slope Compensation
          9. 8.2.2.2.9  Loop Compensation
          10. 8.2.2.2.10 Input Capacitance
          11. 8.2.2.2.11 NFET
          12. 8.2.2.2.12 Diode
          13. 8.2.2.2.13 Input UVLO
          14. 8.2.2.2.14 Output OVLO
          15. 8.2.2.2.15 Soft-Start
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Boost Application
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
      4. 8.2.4 Buck-Boost Application
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedures
      5. 8.2.5 Boost Application
        1. 8.2.5.1 Design Requirements
        2. 8.2.5.2 Detailed Design Procedure
      6. 8.2.6 Buck-Boost Application
        1. 8.2.6.1 Design Requirements
        2. 8.2.6.2 Detailed Design Procedure
      7. 8.2.7 Buck Application
        1. 8.2.7.1 Design Requirements
        2. 8.2.7.2 Detailed Design Procedure
      8. 8.2.8 Buck-Boost Application
        1. 8.2.8.1 Design Requirements
        2. 8.2.8.2 Detailed Design Procedure
      9. 8.2.9 SEPIC Application
        1. 8.2.9.1 Design Requirements
        2. 8.2.9.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
    1. 9.1 Input Supply Current Limit
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Voltage VIN, EN, nDIM –0.3 76 V
OVP, HSP, HSN –0.3 76
IS –0.3 76
–2 for 100 ns
VCC –0.3 8
VS, TREF, TSENSE, TGAIN, COMP, CSH, RT, SLOPE, SS –0.3 6
GATE, DDRV –0.3 VCC
–2.5 for 100 ns VCC + 2.5 for 100 ns
GND –0.3 0.3
–2.5 for 100 ns 2.5 for 100 ns
Continuous current VIN, EN, nDIM –1 mA
OVP, HSP, HSN –100 µA
IS –1 mA
SS –30 30 µA
GATE, DDRV –1 1 mA
Continuous power dissipation Internally Limited
Maximum Junction Temperature Internally Limited °C
Maximum lead temperature (Reflow and Solder)(3) 260 °C
Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.
(3) Refer toTI’s packaging website for more detailed information and mounting techniques. http://www.ti.com/analogpackaging