SNVS603D August   2009  – July 2019 LM3424

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Typical Boost Application Circuit
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Current Regulators
      2. 7.3.2  Peak Current Mode Control
      3. 7.3.3  Average LED Current
      4. 7.3.4  Thermal Foldback and Analog Dimming
      5. 7.3.5  Current Sense and Current Limit
      6. 7.3.6  Slope Compensation
      7. 7.3.7  Control Loop Compensation
      8. 7.3.8  Start-Up Regulator and Soft-Start
      9. 7.3.9  Overvoltage Lockout (OVLO)
      10. 7.3.10 Input Undervoltage Lockout (UVLO)
        1. 7.3.10.1 UVLO Only
        2. 7.3.10.2 PWM Dimming and UVLO
      11. 7.3.11 PWM Dimming
      12. 7.3.12 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Inductor
      2. 8.1.2 LED Dynamic Resistance
      3. 8.1.3 Output Capacitor
      4. 8.1.4 Input Capacitors
      5. 8.1.5 Main MOSFET and Dimming MOSFET
      6. 8.1.6 Re-Circulating Diode
      7. 8.1.7 Switching Frequency
    2. 8.2 Typical Applications
      1. 8.2.1 Basic Topology Schematics
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Operating Point
          2. 8.2.1.2.2  Switching Frequency
          3. 8.2.1.2.3  Average LED Current
          4. 8.2.1.2.4  Thermal Foldback
          5. 8.2.1.2.5  Inductor Ripple Current
          6. 8.2.1.2.6  LED Ripple Current
          7. 8.2.1.2.7  Peak Current Limit
          8. 8.2.1.2.8  Slope Compensation
          9. 8.2.1.2.9  Loop Compensation
          10. 8.2.1.2.10 Input Capacitance
          11. 8.2.1.2.11 NFET
          12. 8.2.1.2.12 Diode
          13. 8.2.1.2.13 Output OVLO
          14. 8.2.1.2.14 Input UVLO
          15. 8.2.1.2.15 Soft-Start
          16. 8.2.1.2.16 PWM Dimming Method
          17. 8.2.1.2.17 Analog Dimming Method
      2. 8.2.2 Buck-Boost Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1  Operating Point
          2. 8.2.2.2.2  Switching Frequency
          3. 8.2.2.2.3  Average LED Current
          4. 8.2.2.2.4  Thermal Foldback
          5. 8.2.2.2.5  Inductor Ripple Current
          6. 8.2.2.2.6  Output Capacitance
          7. 8.2.2.2.7  Peak Current Limit
          8. 8.2.2.2.8  Slope Compensation
          9. 8.2.2.2.9  Loop Compensation
          10. 8.2.2.2.10 Input Capacitance
          11. 8.2.2.2.11 NFET
          12. 8.2.2.2.12 Diode
          13. 8.2.2.2.13 Input UVLO
          14. 8.2.2.2.14 Output OVLO
          15. 8.2.2.2.15 Soft-Start
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Boost Application
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
      4. 8.2.4 Buck-Boost Application
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedures
      5. 8.2.5 Boost Application
        1. 8.2.5.1 Design Requirements
        2. 8.2.5.2 Detailed Design Procedure
      6. 8.2.6 Buck-Boost Application
        1. 8.2.6.1 Design Requirements
        2. 8.2.6.2 Detailed Design Procedure
      7. 8.2.7 Buck Application
        1. 8.2.7.1 Design Requirements
        2. 8.2.7.2 Detailed Design Procedure
      8. 8.2.8 Buck-Boost Application
        1. 8.2.8.1 Design Requirements
        2. 8.2.8.2 Detailed Design Procedure
      9. 8.2.9 SEPIC Application
        1. 8.2.9.1 Design Requirements
        2. 8.2.9.2 Detailed Design Procedure
  9. 9 Power Supply Recommendations
    1. 9.1 Input Supply Current Limit
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

The performance of any switching regulator depends as much upon the layout of the PCB as the component selection. Following a few simple guidelines will maximimize noise rejection and minimize the generation of EMI within the circuit.

Discontinuous currents are the most likely to generate EMI, therefore care should be taken when routing these paths. The main path for discontinuous current in the LM3424 buck regulator contains the input capacitor (CIN), the recirculating diode (D1), the N-channel MOSFET (Q1), and the sense resistor (RLIM). In the LM3424 boost regulator, the discontinuous current flows through the output capacitor (CO), D1, Q1, and RLIM. In the buck-boost regulator both loops are discontinuous and should be carefully laid out. These loops should be kept as small as possible and the connections between all the components should be short and thick to minimize parasitic inductance. In particular, the switch node (where L1, D1, and Q1 connect) should be just large enough to connect the components. To minimize excessive heating, large copper pours can be placed adjacent to the short current path of the switch node.

The RT, COMP, CSH, IS, TSENSE, TREF, HSP, and HSN pins are all high-impedance inputs which couple external noise easily, therefore the loops containing these nodes should be minimized whenever possible.

In some applications the LED or LED array can be far away (several inches or more) from the LM3424, or on a separate PCB connected by a wiring harness. When an output capacitor is used and the LED array is large or separated from the rest of the regulator, the output capacitor should be placed close to the LEDs to reduce the effects of parasitic inductance on the AC impedance of the capacitor.