SNOS719H September   1999  – January 2025 LMC7101Q-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics for VS = 2.7V or ±1.35V
    6. 5.6  Electrical Characteristics for VS = 3V or ±1.5V
    7. 5.7  Electrical Characteristics for VS = 5V or ±2.5V
    8. 5.8  Electrical Characteristics for VS = 15V or ±7.5V
    9. 5.9  Typical Characteristics for VS = 2.7V
    10. 5.10 Typical Characteristics for VS = 3V
    11. 5.11 Typical Characteristics for VS = 5V
    12. 5.12 Typical Characteristics for VS = 15V
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Benefits of the LMC7101 Tiny Amplifier
        1. 6.3.1.1 Size
        2. 6.3.1.2 Height
        3. 6.3.1.3 Signal Integrity
        4. 6.3.1.4 Simplified Board Layout
        5. 6.3.1.5 Low THD
        6. 6.3.1.6 Low Supply Current
        7. 6.3.1.7 Wide Voltage Range
    4. 6.4 Device Functional Modes
      1. 6.4.1 Input Common-Mode Voltage Range
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Rail-to-Rail Output
      2. 7.1.2 Capacitive Load Tolerance
      3. 7.1.3 Compensating for Input Capacitance When Using Large Value Feedback Resistors
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.1.3 Signal Integrity

Signals can pick up noise between the signal source and the amplifier. By using a physically smaller amplifier package, the tiny amplifier can be placed closer to the signal source, thus reducing noise pickup and increasing signal integrity. The tiny amplifier can also be placed next to the signal destination, such as a buffer, for the reference of an analog-to-digital converter.