SNOS719H September   1999  – January 2025 LMC7101Q-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics for VS = 2.7V or ±1.35V
    6. 5.6  Electrical Characteristics for VS = 3V or ±1.5V
    7. 5.7  Electrical Characteristics for VS = 5V or ±2.5V
    8. 5.8  Electrical Characteristics for VS = 15V or ±7.5V
    9. 5.9  Typical Characteristics for VS = 2.7V
    10. 5.10 Typical Characteristics for VS = 3V
    11. 5.11 Typical Characteristics for VS = 5V
    12. 5.12 Typical Characteristics for VS = 15V
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Benefits of the LMC7101 Tiny Amplifier
        1. 6.3.1.1 Size
        2. 6.3.1.2 Height
        3. 6.3.1.3 Signal Integrity
        4. 6.3.1.4 Simplified Board Layout
        5. 6.3.1.5 Low THD
        6. 6.3.1.6 Low Supply Current
        7. 6.3.1.7 Wide Voltage Range
    4. 6.4 Device Functional Modes
      1. 6.4.1 Input Common-Mode Voltage Range
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Rail-to-Rail Output
      2. 7.1.2 Capacitive Load Tolerance
      3. 7.1.3 Compensating for Input Capacitance When Using Large Value Feedback Resistors
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision G (September 2015) to Revision H (January 2025)

  • Moved LMC7101 commercial device into new SBOSAL2 data sheetGo
  • Updated Features Go
  • Updated Description Go
  • Updated pin diagram figure and pin names in Pin Configuration and Functions Go
  • Deleted Machine model (MM) from ESD Ratings Go
  • Changed temperature test conditions from junction temperature, TJ to ambient temperature, TA throughoutGo
  • Updated Thermal Information Go
  • Updated formatting across all Electrical Characteristics Go
  • Updated parameter names to be consistent with modern data sheetsGo
  • Added missing input offset voltage drift temperature condition in all Electrical Characteritics Go
  • Updated temperature range conditions in input bias current and input offset current in all Electrical CharacteristicsGo
  • Changed input common-mode voltage condition from CMRR ≥ 50dB to CMRR ≥ 47dBGo
  • Changed CMRR MIN from 50dB to 47dBGo
  • Deleted footnotes 1 and 2 in all Electrical Characteristics Go
  • Changed input common-mode voltage condition from CMRR > 50dB to CMRR > 47dBGo
  • Changed CMRR MIN from 60dB to 47dB and TYP from 74dB to 70dB Go
  • Changed CMRR MIN from 60dB to 52dB and TYP from 82dB to 75dBGo
  • Changed CMRR MIN for TA = –40°C to +125°C from 60dB to 51dB and TYP from 82dB to 74dBGo
  • Changed input common-mode voltage test condition from (V+) = 5V to (V+) = 15VGo
  • Changed CMRR MIN from 65dB to 62dBGo
  • Deleted Figures 6, 11, 14, 17, 20, 23, and 37Go
  • Added Figure 5-6Go
  • Added Figures 5-21 and 5-25Go
  • Updated description text in Size Go
  • Updated Figure 7-3, Example Application to show correct noninverting circuitGo

Changes from Revision F (March 2013) to Revision G (September 2015)

  • Added Pin Configuration and Functions, ESD Ratings, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo

Changes from Revision E (March 2013) to Revision F (March 2013)

  • Changed layout of National Semiconductor Data Sheet to TI formatGo