SNAS847 November   2023 LMK3H0102

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Interface Specification
  7. 6 Differential Voltage Measurement Terminology
  8. 7 Parameter Measurement Information
    1. 7.1 Output Format Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Device Block-Level Description
      2. 8.3.2 Device Configuration Control
      3. 8.3.3 OTP Mode
      4. 8.3.4 I2C Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Fail-Safe Inputs
      2. 8.4.2 Fractional Output Dividers
        1. 8.4.2.1 FOD Operation
        2. 8.4.2.2 Edge Combiner
        3. 8.4.2.3 Digital State Machine
        4. 8.4.2.4 Spread-Spectrum Clocking
        5. 8.4.2.5 Integer Boundary Spurs
      3. 8.4.3 Output Behavior
        1. 8.4.3.1 Output Format Selection
          1. 8.4.3.1.1 Output Format Types
            1. 8.4.3.1.1.1 LP-HCSL Termination
        2. 8.4.3.2 Output Slew Rate Control
        3. 8.4.3.3 REF_CTRL Operation
      4. 8.4.4 Output Enable
        1. 8.4.4.1 Output Enable Control
        2. 8.4.4.2 Output Enable Polarity
        3. 8.4.4.3 Individual Output Enable
        4. 8.4.4.4 Output Disable Behavior
      5. 8.4.5 Device Default Settings
    5. 8.5 Programming
      1. 8.5.1 I2C Serial Interface
      2. 8.5.2 One-Time Programming Sequence
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Application Block Diagram Examples
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Example: Changing Output Frequency
      5. 9.2.5 Crosstalk
      6. 9.2.6 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power-Up Sequencing
      2. 9.3.2 Decoupling Power Supply Inputs
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device Registers
    1. 10.1 Register Maps
      1. 10.1.1  R0 Register (Address = 0x0) [reset = 0x0861]
      2. 10.1.2  R1 Register (Address = 0x1) [reset = 0x5599]
      3. 10.1.3  R2 Register (Address = 0x2) [reset = 0xC28F]
      4. 10.1.4  R3 Register (Address = 0x3) [reset = 0x1801]
      5. 10.1.5  R4 Register (Address = 0x4) [reset = 0x0000]
      6. 10.1.6  R5 Register (Address = 0x5) [reset = 0x0000]
      7. 10.1.7  R6 Register (Address = 0x6) [reset = 0x2AA0]
      8. 10.1.8  R7 Register (Address = 0x7) [reset = 0x6503]
      9. 10.1.9  R8 Register (Address = 0x8) [reset = 0xC28F]
      10. 10.1.10 R9 Register (Address = 0x9) [reset = 0x0066]
      11. 10.1.11 R10 Register (Address = 0xA) [reset = 0x0010]
      12. 10.1.12 R11 Register (Address = 0xB) [reset = 0x0000]
      13. 10.1.13 R12 Register (Address = 0xC) [reset = 0xE800]
      14. 10.1.14 R146 Register (Address = 0x92) [reset = 0x0000]
      15. 10.1.15 R147 Register (Address = 0x93) [reset = 0x0000]
      16. 10.1.16 R148 Register (Address = 0x94) [reset = 0x0000]
      17. 10.1.17 R238 Register (Address = 0xEE) [reset = 0x0000]
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Option Addendum
    2. 13.2 Tape and Reel Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RER|16
Thermal pad, mechanical data (Package|Pins)

10.1.10 R9 Register (Address = 0x9) [reset = 0x0066]

R9 is shown in Table 10-19.

Return to the Summary Table.

Table 10-12 R9 Register Field Descriptions
BitFieldTypeResetDescription
15:12OTP_IDR/W0x3Configurable field for identifying the OTP configuration. Can be used in I2C mode as a 4-bit spare field. This field is stored in the EFUSE.
11:9SSC_CONFIG_SELR/W0x0

SSC modulation configuration. If center-spread modulation is desired, then custom SSC configuration is required. Four preconfigured down-spread modulation depths are also available. Any other modulation depths require custom SSC configuration. This field is stored in the EFUSE.

The preconfigured SSC options are specifically for 100 MHz clock outputs. For other output frequencies, TI recommends creating a custom SSC configuration.

0h: Custom SSC Configuration - see Spread Spectrum Clocking for details on creating a custom configuration.

1h: –0.10% preconfigured down-spread.

2h: –0.25% preconfigured down-spread.

3h: –0.30% preconfigured down-spread.

4h: –0.50% preconfigured down-spread.

All other values: Reserved

8OUT_FMT_SRC_SELR/W0x0

Forces the FMT_ADDR pin to override the output format register settings in OTP Mode. When in I2C mode, the FMT_ADDR pin is never used for this purpose. This field is stored in the EFUSE.

0h: FMT_ADDR pin is ignored in OTP mode.

1h: FMT_ADDR pin overrides the register settings. The output format is LP-HCSL, and the termination resistor values are based on the FMT_ADDR pin state on start-up.

7:4OUT1_LPHSCL_AMP_SELR/W0x3

OUT1 output swing level when using LP-HCSL output format. This field is stored in the EFUSE.

0h: 625 mV.

1h: 647 mV.

2h: 668 mV.

3h: 690 mV.

4h: 712 mV.

5h: 733 mV.

6h: 755 mV.

7h: 777 mV.

8h: 798 mV.

9h: 820 mV.

Ah: 842 mV.

Bh: 863 mV.

Ch: 885 mV.

Dh: 907 mV.

Eh: 928 mV.

Fh: 950 mV.

3:0OUT0_LPHSCL_AMP_SELR/W0x6

OUT0 output swing level when using LP-HCSL output format. This field is stored in the EFUSE.

0h: 625 mV.

1h: 647 mV.

2h: 668 mV.

3h: 690 mV.

4h: 712 mV.

5h: 733 mV.

6h: 755 mV.

7h: 777 mV.

8h: 798 mV.

9h: 820 mV.

Ah: 842 mV.

Bh: 863 mV.

Ch: 885 mV.

Dh: 907 mV.

Eh: 928 mV.

Fh: 950 mV.