SNVS817B June   2012  – June 2019 LMR12015 , LMR12020

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Descriptions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Ratings
    3. 6.3 Electrical Characteristics
    4. 6.4 Typical Performance Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Boost Function
      2. 7.3.2  Low Input Voltage Considerations
      3. 7.3.3  High Output Voltage Considerations
      4. 7.3.4  Frequency Synchronization
      5. 7.3.5  Current Limit
      6. 7.3.6  Frequency Foldback
      7. 7.3.7  Soft Start
      8. 7.3.8  Output Overvoltage Protection
      9. 7.3.9  Undervoltage Lockout
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Operation Modes
      1. 7.4.1 Enable Pin / Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1  Custom Design With WEBENCH® Tools
        2. 8.2.1.2  Inductor Selection
          1. 8.2.1.2.1 Inductor Calculation Example
          2. 8.2.1.2.2 Inductor Material Selection
        3. 8.2.1.3  Input Capacitor
        4. 8.2.1.4  Output Capacitor
        5. 8.2.1.5  Catch Diode
        6. 8.2.1.6  Boost Diode (Optional)
        7. 8.2.1.7  Boost Capacitor
        8. 8.2.1.8  Output Voltage
        9. 8.2.1.9  Feedforward Capacitor (Optional)
        10. 8.2.1.10 Calculating Efficiency and Junction Temperature
          1. 8.2.1.10.1 Schottky Diode Conduction Losses
          2. 8.2.1.10.2 Inductor Conduction Losses
          3. 8.2.1.10.3 MOSFET Conduction Losses
          4. 8.2.1.10.4 MOSFET Switching Losses
          5. 8.2.1.10.5 IC Quiescent Losses
          6. 8.2.1.10.6 MOSFET Driver Losses
          7. 8.2.1.10.7 Total Power Losses
          8. 8.2.1.10.8 Efficiency Calculation Example
          9. 8.2.1.10.9 Calculating the LMR2015/20 Junction Temperature
      2. 8.2.2 Application Curves
      3. 8.2.3 LMR12015/20 Circuit Examples
  9. 9 Layout
    1. 9.1 Layout Considerations
      1. 9.1.1 Compact Layout
      2. 9.1.2 Ground Plane and Shape Routing
      3. 9.1.3 FB Loop
      4. 9.1.4 PCB Summary
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Related Links
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Community Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1.2.1 Custom Design With WEBENCH® Tools

Click here to create a custom design using the LMR12015 device with the WEBENCH® Power Designer.

  1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
  2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
  3. Compare the generated design with other possible solutions from Texas Instruments.

The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time pricing and component availability.

In most cases, these actions are available:

  • Run electrical simulations to see important waveforms and circuit performance
  • Run thermal simulations to understand board thermal performance
  • Export customized schematic and layout into popular CAD formats
  • Print PDF reports for the design, and share the design with colleagues

Get more information about WEBENCH tools at www.ti.com/WEBENCH.