SLVSBM9E October   2013  – September 2018 LMZ31520

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Efficiency
  3. 3 Description
    1.     Simplified Application
  4. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Thermal Information
    4. 4.4 Package Specifications
    5. 4.5 Electrical Characteristics
  5. 5 Device Information
    1.     Pin Functions
    2. 5.1 Functional Block Diagram
  6. 6 Typical Characteristics (PVIN = VIN = 12 V)
  7. 7 Typical Characteristics (PVIN = VIN = 5 V)
  8. 8 Application Information
    1. 8.1  Adjusting the Output Voltage
    2. 8.2  Frequency Select
    3. 8.3  Capacitor Recommendations for the LMZ31520 Power Supply
      1. 8.3.1 Capacitor Technologies
        1. 8.3.1.1 Electrolytic, Polymer-Electrolytic Capacitors
        2. 8.3.1.2 Ceramic Capacitors
        3. 8.3.1.3 Tantalum, Polymer-Tantalum Capacitors
        4. 8.3.1.4 Input Capacitor
        5. 8.3.1.5 Output Capacitor
    4. 8.4  Transient Response
    5. 8.5  Application Curves Device configured for FCCM mode of operation, (pin 3 connected to pin 19).
    6. 8.6  Application Schematics
    7. 8.7  Custom Design With WEBENCH® Tools
    8. 8.8  VIN and PVIN Input Voltage
    9. 8.9  3.3 V PVIN Operation
    10. 8.10 Power Good (PWRGD)
    11. 8.11 Slow Start (SS_SEL)
    12. 8.12 Auto-Skip Eco-mode / Forced Continuous Conduction Mode
    13. 8.13 Power-Up Characteristics
    14. 8.14 Pre-Biased Start-Up
    15. 8.15 Remote Sense
    16. 8.16 Output On/Off Inhibit (INH)
    17. 8.17 Overcurrent Protection
    18. 8.18 Current Limit (ILIM) Adjust
    19. 8.19 Thermal Shutdown
    20. 8.20 Layout Considerations
    21. 8.21 EMI
  9. 9 Revision History
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Community Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RLG|72
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.3 Thermal Information

THERMAL METRIC(1) LMZ31520 UNIT
RLG
72 PINS
θJA Junction-to-ambient thermal resistance(2) Natural Convection 8.6 °C/W
θJA(100LFM) Junction-to-ambient thermal resistance(3) 100 LFM 7.8 °C/W
ψJT Junction-to-top characterization parameter(4) 1.6 °C/W
ψJB Junction-to-board characterization parameter(5) 4.2 °C/W
(1) For more information about traditional and new thermal metrics, see theSemiconductor and IC Package Thermal Metrics application report (SPRA953).
(2) The junction-to-ambient thermal resistance, θJA, applies to devices soldered directly to a 100 mm x 100 mm, 6-layer PCB with 1 oz. copper and natural convection cooling. Additional airflow reduces θJA.
(3) The junction-to-ambient thermal resistance, θJA, applies to devices soldered directly to a 100 mm x 100 mm, 6-layer PCB with 1 oz. copper and 100 LFM forced air cooling. Additional airflow reduces θJA.
(4) The junction-to-top characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJT * Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device.
(5) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB * Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1mm from the device.