SLVSBC7E October   2013  – September 2018 LMZ31530

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Efficiency
  3. 3 Description
    1.     Simplified Application
  4. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Thermal Information
    4. 4.4 Package Specifications
    5. 4.5 Electrical Characteristics
  5. 5 Device Information
    1.     Pin Functions
    2. 5.1 Functional Block Diagram
  6. 6 Typical Characteristics (PVIN = VIN = 12 V)
  7. 7 Typical Characteristics (PVIN = VIN = 5 V)
  8. 8 Application Information
    1. 8.1  Adjusting the Output Voltage
    2. 8.2  Frequency Select
    3. 8.3  Capacitor Recommendations for the LMZ31530 Power Supply
      1. 8.3.1 Capacitor Technologies
        1. 8.3.1.1 Electrolytic, Polymer-Electrolytic Capacitors
        2. 8.3.1.2 Ceramic Capacitors
        3. 8.3.1.3 Tantalum, Polymer-Tantalum Capacitors
      2. 8.3.2 Input Capacitor
      3. 8.3.3 Output Capacitor
    4. 8.4  Transient Response
    5. 8.5  Application Curves
    6. 8.6  Application Schematics
    7. 8.7  Custom Design With WEBENCH® Tools
    8. 8.8  VIN and PVIN Input Voltage
    9. 8.9  3.3 V PVIN Operation
    10. 8.10 Power Good (PWRGD)
    11. 8.11 Slow Start (SS_SEL)
    12. 8.12 Auto-Skip Eco-mode / Forced Continuous Conduction Mode
    13. 8.13 Power-Up Characteristics
    14. 8.14 Pre-Biased Start-Up
    15. 8.15 Remote Sense
    16. 8.16 Output On/Off Inhibit (INH)
    17. 8.17 Overcurrent Protection
    18. 8.18 Current Limit (ILIM) Adjust
    19. 8.19 Thermal Shutdown
    20. 8.20 Layout Considerations
    21. 8.21 EMI
  9. 9 Revision History
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Community Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RLG|72
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.1 Absolute Maximum Ratings(1)

over operating temperature range (unless otherwise noted)
VALUE UNIT
MIN MAX
Input Voltage VIN, PVIN –0.3 20 V
INH, VADJ, PWRGD, PWRGD_PU, ILIM, FREQ_SEL, SS_SEL, V5V –0.3 7 V
Output Voltage PH –1 25 V
PH 10ns Transient –2 27
VOUT –0.3 6 V
VDIFF (GND to exposed thermal pad) ±200 mV
Operating Junction Temperature –40 125(2) °C
Storage Temperature –55 150 °C
Peak Reflow Case Temperature(3) 245(4) °C
Maximum Number of Reflows Allowed(3) 3(4)
Mechanical Shock Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted 250 G
Mechanical Vibration Mil-STD-883D, Method 2007.2, 20-2000Hz 20
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) See the temperature derating curves in the Typical Characteristics section for thermal information.
(3) For soldering specifications, refer to the Soldering Requirements for BQFN Packages application note.
(4) Devices with a date code prior to week 14 2018 (1814) have a peak reflow case temperature of 240°C with a maximum of one reflow