SNVSAZ9 March   2022 LP8764-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. 5.1 Digital Signal Descriptions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Internal Low Drop-Out Regulators (LDOVINT)
    6. 6.6  BUCK1, BUCK2, BUCK3, and BUCK4 Regulators
    7. 6.7  Reference Generator (REFOUT)
    8. 6.8  Monitoring Functions
    9. 6.9  Clocks, Oscillators, and DPLL
    10. 6.10 Thermal Monitoring and Shutdown
    11. 6.11 System Control Thresholds
    12. 6.12 Current Consumption
    13. 6.13 Digital Input Signal Parameters
    14. 6.14 Digital Output Signal Parameters
    15. 6.15 I/O Pullup and Pulldown Resistance
    16. 6.16 I2C Interface
    17. 6.17 Serial Peripheral Interface (SPI)
      1.      25
  7. 7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  Functional Block Diagram
    3. 8.3  Input Voltage Monitor
    4. 8.4  Device State Machine
      1. 8.4.1 Fixed Device Power FSM
        1. 8.4.1.1 Register Resets and EEPROM read at INIT state
      2. 8.4.2 Pre-Configurable Mission States
        1. 8.4.2.1 PFSM Commands
          1. 8.4.2.1.1  REG_WRITE_IMM Command
          2. 8.4.2.1.2  REG_WRITE_MASK_IMM Command
          3. 8.4.2.1.3  REG_WRITE_MASK_PAGE0_IMM Command
          4. 8.4.2.1.4  REG_WRITE_BIT_PAGE0_IMM Command
          5. 8.4.2.1.5  REG_WRITE_WIN_PAGE0_IMM Command
          6. 8.4.2.1.6  REG_WRITE_VOUT_IMM Command
          7. 8.4.2.1.7  REG_WRITE_VCTRL_IMM Command
          8. 8.4.2.1.8  REG_WRITE_MASK_SREG Command
          9. 8.4.2.1.9  SREG_READ_REG Command
          10. 8.4.2.1.10 SREG_WRITE_IMM Command
          11. 8.4.2.1.11 WAIT Command
          12. 8.4.2.1.12 DELAY_IMM Command
          13. 8.4.2.1.13 DELAY_SREG Command
          14. 8.4.2.1.14 TRIG_SET Command
          15. 8.4.2.1.15 TRIG_MASK Command
          16. 8.4.2.1.16 END Command
        2. 8.4.2.2 Configuration Memory Organization and Sequence Execution
        3. 8.4.2.3 Mission State Configuration
        4. 8.4.2.4 Pre-Configured Hardware Transitions
          1. 8.4.2.4.1 ON Requests
          2. 8.4.2.4.2 OFF Requests
            1. 8.4.2.4.2.1 NSLEEP1 and NSLEEP2 Functions
            2. 8.4.2.4.2.2 WKUP1 and WKUP2 Functions
      3. 8.4.3 Error Handling Operations
        1. 8.4.3.1 Power Rail Output Error
        2. 8.4.3.2 Boot BIST Error
        3. 8.4.3.3 Runtime BIST Error
        4. 8.4.3.4 Catastrophic Error
        5. 8.4.3.5 Watchdog (WDOG) Error
        6. 8.4.3.6 Error Signal Monitor (ESM) Error
        7. 8.4.3.7 Warnings
      4. 8.4.4 Device Start-up Timing
      5. 8.4.5 Power Sequences
      6. 8.4.6 First Supply Detection
    5. 8.5  Power Resources
      1. 8.5.1 Buck Regulators
        1. 8.5.1.1 BUCK Regulator Overview
        2. 8.5.1.2 Multi-Phase Operation and Phase-Adding or Shedding
        3. 8.5.1.3 Transition Between PWM and PFM Modes
        4. 8.5.1.4 Spread-Spectrum Mode
        5. 8.5.1.5 Adaptive Voltage Scaling (AVS) and Dynamic Voltage Scaling (DVS) Support
        6. 8.5.1.6 BUCK Output Voltage Setting
      2. 8.5.2 Sync Clock Functionality
      3. 8.5.3 Internal Low Dropout Regulator (LDOVINT)
    6. 8.6  Residual Voltage Checking
    7. 8.7  Output Voltage Monitor and PGOOD Generation
    8. 8.8  General-Purpose I/Os (GPIO Pins)
    9. 8.9  Thermal Monitoring
      1. 8.9.1 Thermal Warning Function
      2. 8.9.2 Thermal Shutdown
    10. 8.10 Interrupts
    11. 8.11 Control Interfaces
      1. 8.11.1 CRC Calculation for I2C and SPI Interface Protocols
      2. 8.11.2 I2C-Compatible Interface
        1. 8.11.2.1 Data Validity
        2. 8.11.2.2 Start and Stop Conditions
        3. 8.11.2.3 Transferring Data
        4. 8.11.2.4 Auto-Increment Feature
      3. 8.11.3 Serial Peripheral Interface (SPI)
    12. 8.12 Multi-PMIC Synchronization
      1. 8.12.1 SPMI Interface System Setup
      2. 8.12.2 Transmission Protocol and CRC
        1. 8.12.2.1 Operation with Transmission Errors
        2. 8.12.2.2 Transmitted Information
      3. 8.12.3 SPMI Target Device Communication to SPMI Controller Device
        1. 8.12.3.1 Incomplete Communication from SPMI Target Device to SPMI Controller Device
      4. 8.12.4 SPMI-BIST Overview
        1. 8.12.4.1 SPMI Bus during Boot BIST and RUNTIME BIST
        2. 8.12.4.2 Periodic Checking of the SPMI
        3. 8.12.4.3 SPMI Message Priorities
    13. 8.13 NVM Configurable Registers
      1. 8.13.1 Register Page Partitioning
      2. 8.13.2 CRC Protection for Configuration, Control, and Test Registers
      3. 8.13.3 CRC Protection for User Registers
      4. 8.13.4 Register Write Protection
        1. 8.13.4.1 ESM and WDOG Configuration Registers
        2. 8.13.4.2 User Registers
    14. 8.14 Watchdog (WD)
      1. 8.14.1 Watchdog Fail Counter and Status
      2. 8.14.2 Watchdog Start-Up and Configuration
      3. 8.14.3 MCU to Watchdog Synchronization
      4. 8.14.4 Watchdog Disable Function
      5. 8.14.5 Watchdog Sequence
      6. 8.14.6 Watchdog Trigger Mode
      7. 8.14.7 WatchDog Flow Chart and Timing Diagrams in Trigger Mode
      8.      121
      9. 8.14.8 Watchdog Question-Answer Mode
        1. 8.14.8.1 Watchdog Q&A Related Definitions
        2. 8.14.8.2 Question Generation
        3. 8.14.8.3 Answer Comparison
          1. 8.14.8.3.1 Sequence of the 2-bit Watchdog Answer Counter
          2. 8.14.8.3.2 Watchdog Sequence Events and Status Updates
          3. 8.14.8.3.3 Watchdog Q&A Sequence Scenarios
    15. 8.15 Error Signal Monitor (ESM)
      1. 8.15.1 ESM Error-Handling Procedure
      2. 8.15.2 Level Mode
      3.      132
      4. 8.15.3 PWM Mode
        1. 8.15.3.1 Good-Events and Bad-Events
        2. 8.15.3.2 ESM Error-Counter
          1. 8.15.3.2.1 ESM Start-Up in PWM Mode
        3. 8.15.3.3 ESM Flow Chart and Timing Diagrams in PWM Mode
        4.       138
    16. 8.16 Register Map
      1. 8.16.1 LP8764x_map Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Buck Inductor Selection
        2. 9.2.1.2 Buck Input Capacitor Selection
        3. 9.2.1.3 Buck Output Capacitor Selection
        4. 9.2.1.4 LDO Output Capacitor Selection
        5. 9.2.1.5 VCCA Supply Filtering Components
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Voltage Scaling Precautions
      4. 9.2.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.2.3 Mission State Configuration

The Mission States portion of the FSM engine manages the sequencing of power rails and external outputs in the user defined states. The rest of Device State Machine the Figure 8-6 is used as an example state machine that is defined through the configuration memory using the configuration FSM instructions.

GUID-20200827-CA0I-CPK6-8QXV-8ZDLLK7ZFJ7C-low.gif Figure 8-6 Example of a Mission State-Machine

Each power state (light blue bubbles in Figure 8-6) defines the ON or OFF state and the sequencing timing of the external regulators and GPIO outputs. This example defines 4 power states: STANDBY, ACTIVE, MCU ONLY, and DEEP_SLEEP/S2R states. The priority order of these states is as follows:

  1. ACTIVE
  2. MCU ONLY
  3. DEEP SLEEP/S2R
  4. STANDBY

The transitions between each power state is determined by the trigger signals source pre-selected from Table 8-5. These triggers are then placed in the order of priority through the trigger ID assignment of each trigger source. The critical error triggers are placed first, some specified as immediate triggers that can interrupt an on-going sequence. The non-error triggers, which are used to enable state transitions during normal device operation, are then placed according to the priority order of the state the device is transitioning to. Table 8-6 list the trigger signal sources, in the order of priority, used to define the power states and transitions of the example mission state machine shown in Figure 8-6. This table also helps to determine which triggers must be masked by the TRIG_MASK command upon arriving a pre-defined power state to produce the desired PFSM behavior.

Table 8-6 List of Trigger Used in Example Mission State Machine
Trigger ID Trigger Signal State Transitions Trigger Masked In Each User Defined Power State
STANDBY ACTIVE MCU ONLY DEEP SLEEP / S2R
0 IMMEDIATE_SHUTDOWN (1) From any state to SAFE RECOVERY
1 MCU_POWER_ERROR (1) From any state to SAFE RECOVERY
2 ORDERLY_SHUTDOWN (1) From any state to SAFE RECOVERY
3 TRIGGER_FORCE_STANDBY From any state to STANDBY or LP_STANDBY Masked
4 WD_ERROR Perform warm reset of all power rails and return to ACTIVE Masked Masked Masked
5 ESM_MCU_ERROR Perform warm reset of all power rails and return to ACTIVE Masked Masked Masked
7 WD_ERROR Perform warm reset of all power rails and return to MCU ONLY Masked Masked Masked
8 ESM_MCU_ERROR Perform warm reset of all power rails and return to MCU ONLY Masked Masked Masked
9 SOC_POWER_ERROR ACTIVE to MCU ONLY Masked Masked Masked
10 TRIGGER _I2C_1 (self-cleared) Start RUNTIME_BIST Masked Masked
11 TRIGGER_I2C_2 (self-cleared) Enable I2C CRC Function Masked Masked
12 TRIGGER_SU_ACTIVE STANDBY to ACTIVE Masked Masked
13 TRIGGER_WKUP1 Any State to ACTIVE
14 TRIGGER_A (NSLEEP2&NSLEEP1 = '11') MCU ONLY or DEEP SLEEP/S2R to ACTIVE Masked
15 TRIGGER_SU_MCU_ONLY STANDBY to MCU ONLY Masked Masked
16 TRIGGER_WKUP2 STANDBY or DEEP SLEEP/S2R to MCU ONLY Masked
17 TRIGGER_B (NSLEEP2&NSLEEP1 = '10') ACTIVE or DEEP SLEEP/S2R to MCU ONLY Masked
18 TRIGGER_D or TRIGGER_C (NSLEEP2 = '0' ) ACTIVE or MCU ONLY to DEEP SLEEP/S2R Masked Masked
19 TRIGGER_I2C_0 (self-cleared) Any state to STANDBY Masked Masked
20 Always '1' (2) STANDBY to SAFE RECOVERY Mask Masked Masked Masked
21 Not Used Mask Masked Masked Masked
22 Not Used Mask Masked Masked Masked
23 Not Used Mask Masked Masked Masked
24 Not Used Mask Masked Masked Masked
25 Not Used Mask Masked Masked Masked
26 Not Used Mask Masked Masked Masked
27 Not Used Mask Masked Masked Masked
28-bit TRIG_MASK Value in Hex format: 0xFFE4FF8 0xFF181C0 0xFF01270 0xFFC9FF0
(1) This is an immediate trigger.
(2) When an error occurs, which requires the device to enter directly to the SAFE RECOVERY state, the mask for this trigger must be removed while all other non-immediate triggers are masked. The device exits the mission states and the FFSM state machine takes over control of the device power states once this trigger is executed.