SLASF11D February   2023  – October 2025 MSPM0G1105 , MSPM0G1106 , MSPM0G1107

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Ramp
      1. 7.6.1 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
        1. 7.9.1.1 SYSOSC Typical Frequency Accuracy
      2. 7.9.2 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 System Phase Lock Loop (SYSPLL)
      4. 7.9.4 Low Frequency Crystal/Clock
      5. 7.9.5 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
    13. 7.13 Typical Connection Diagram
    14. 7.14 Temperature Sensor
    15. 7.15 VREF
      1. 7.15.1 Voltage Characteristics
      2. 7.15.2 Electrical Characteristics
    16. 7.16 GPAMP
      1. 7.16.1 Electrical Characteristics
      2. 7.16.2 Switching Characteristics
    17. 7.17 I2C
      1. 7.17.1 I2C Timing Diagram
      2. 7.17.2 I2C Characteristics
      3. 7.17.3 I2C Filter
    18. 7.18 SPI
      1. 7.18.1 SPI
      2. 7.18.2 SPI Timing Diagram
    19. 7.19 UART
    20. 7.20 TIMx
    21. 7.21 Emulation and Debug
      1. 7.21.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0G110x)
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 VREF
    15. 8.15 GPAMP
    16. 8.16 CRC
    17. 8.17 UART
    18. 8.18 I2C
    19. 8.19 SPI
    20. 8.20 WWDT
    21. 8.21 RTC
    22. 8.22 Timers (TIMx)
    23. 8.23 Device Analog Connections
    24. 8.24 Input/Output Diagrams
    25. 8.25 Serial Wire Debug Interface
    26. 8.26 Bootstrap Loader (BSL)
    27. 8.27 Device Factory Constants
    28. 8.28 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
  • PT|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Comparison

Table 5-1 Device Comparison
DEVICE NAME (1)(4) FLASH / SRAM (KB) QUAL(2) ADC / CHAN GPAMP UART / I2C / SPI TIMA TIMG GPIO PACKAGE
(PACKAGE SIZE) (3)
MSPM0G1106TPMR 64 / 32 T 2 / 17 1 4 / 2 / 2 2 5 60 64 LQFP
(12mm × 12mm)
MSPM0G1107TPMR 128 / 32
MSPM0G1105TPTR 32 / 16 T 2 / 16 1 4 / 2 / 2 2 5 44 48 LQFP
(9mm × 9mm)
MSPM0G1106TPTR 64 / 32
MSPM0G1107TPTR 128 / 32
MSPM0G1105TRGZR 32 / 16 T 2 / 16 1 4 / 2 / 2 2 5 44 48 VQFN
(7mm × 7mm)
MSPM0G1106TRGZR 64 / 32
MSPM0G1107TRGZR 128 / 32
MSPM0G1106TRHBR 64 / 32 T 2 / 11 1 4 / 2 / 2 2 5 28 32 VQFN
(5mm × 5mm)
MSPM0G1107TRHBR 128 / 32
MSPM0G1107TDGS28R 128 / 32 T 2 / 11 1 4 / 2 / 2 2 5 24 28 VSSOP
(7.1mm × 4.9mm)
MSPM0G1106TYCJR 64 / 32 T 2 / 10 1 4 / 2 / 2 2 5 24 28 DSBGA
(2.65mm × 1.57mm)
MSPM0G1107TYCJR 128 / 32
MSPM0G1107TRGER 128 / 32 T 2 / 9 1 4 / 2 / 2 2 5 20 24 VQFN
(4mm × 4mm)
(1) For the most current part, package, and ordering information for all available devices, see the Package Option Addendum in Section 12, or see the TI website.
(2) Device Qualifications:
  • T = –40°C to 105°C
(3) The package size (length × width) is a nominal value and includes pins, where applicable. For the package dimensions with tolerances, see Section 12.
(4) For more information about the device name, see Section 10.2.