SLASEW9E February   2023  – October 2025 MSPM0G1505 , MSPM0G1506 , MSPM0G1507

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions
    4. 6.4 Connections for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current Characteristics
      1. 7.5.1 RUN/SLEEP Modes
      2. 7.5.2 STOP/STANDBY Modes
      3. 7.5.3 SHUTDOWN Mode
    6. 7.6  Power Supply Sequencing
      1. 7.6.1 Power Supply Ramp
        1. 7.6.1.1 POR and BOR
    7. 7.7  Flash Memory Characteristics
    8. 7.8  Timing Characteristics
    9. 7.9  Clock Specifications
      1. 7.9.1 System Oscillator (SYSOSC)
      2. 7.9.2 SYSOSC Typical Frequency Accuracy
        1. 7.9.2.1 Low Frequency Oscillator (LFOSC)
      3. 7.9.3 System Phase Lock Loop (SYSPLL)
      4. 7.9.4 Low Frequency Crystal/Clock
      5. 7.9.5 High Frequency Crystal/Clock
    10. 7.10 Digital IO
      1. 7.10.1 Electrical Characteristics
      2. 7.10.2 Switching Characteristics
    11. 7.11 Analog Mux VBOOST
    12. 7.12 ADC
      1. 7.12.1 Electrical Characteristics
      2. 7.12.2 Switching Characteristics
      3. 7.12.3 Linearity Parameters
    13. 7.13 Typical Connection Diagram
    14. 7.14 Temperature Sensor
    15. 7.15 VREF
      1. 7.15.1 Voltage Characteristics
      2. 7.15.2 Electrical Characteristics
    16. 7.16 Comparator (COMP)
      1. 7.16.1 Comparator Electrical Characteristics
    17. 7.17 DAC
      1. 7.17.1 DAC_Supply Specifications
      2. 7.17.2 DAC Output Specifications
      3. 7.17.3 DAC Dynamic Specifications
      4. 7.17.4 DAC Linearity Specifications
      5. 7.17.5 DAC Timing Specifications
    18. 7.18 GPAMP
      1. 7.18.1 Electrical Characteristics
      2. 7.18.2 Switching Characteristics
    19. 7.19 OPA
      1. 7.19.1 Electrical Characteristics
      2. 7.19.2 Switching Characteristics
      3. 7.19.3 PGA Mode
    20. 7.20 I2C
      1. 7.20.1 I2C Characteristics
      2. 7.20.2 I2C Filter
        1. 7.20.2.1 I2C Timing Diagram
    21. 7.21 SPI
      1. 7.21.1 SPI
      2. 7.21.2 SPI Timing Diagram
    22. 7.22 UART
    23. 7.23 TIMx
    24. 7.24 TRNG
      1. 7.24.1 TRNG Electrical Characteristics
      2. 7.24.2 TRNG Switching Characteristics
    25. 7.25 Emulation and Debug
      1. 7.25.1 SWD Timing
  9. 8 Detailed Description
    1. 8.1  CPU
    2. 8.2  Operating Modes
      1. 8.2.1 Functionality by Operating Mode (MSPM0G150x)
    3. 8.3  Power Management Unit (PMU)
    4. 8.4  Clock Module (CKM)
    5. 8.5  DMA
    6. 8.6  Events
    7. 8.7  Memory
      1. 8.7.1 Memory Organization
      2. 8.7.2 Peripheral File Map
      3. 8.7.3 Peripheral Interrupt Vector
    8. 8.8  Flash Memory
    9. 8.9  SRAM
    10. 8.10 GPIO
    11. 8.11 IOMUX
    12. 8.12 ADC
    13. 8.13 Temperature Sensor
    14. 8.14 VREF
    15. 8.15 COMP
    16. 8.16 DAC
    17. 8.17 OPA
    18. 8.18 GPAMP
    19. 8.19 TRNG
    20. 8.20 AES
    21. 8.21 CRC
    22. 8.22 UART
    23. 8.23 I2C
    24. 8.24 SPI
    25. 8.25 WWDT
    26. 8.26 RTC
    27. 8.27 Timers (TIMx)
    28. 8.28 Device Analog Connections
    29. 8.29 Input/Output Diagrams
    30. 8.30 Serial Wire Debug Interface
    31. 8.31 Bootstrap Loader (BSL)
    32. 8.32 Device Factory Constants
    33. 8.33 Identification
  10. 9 Applications, Implementation, and Layout
    1. 9.1 Typical Application
      1. 9.1.1 Schematic
  11. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

MSPM0G150x microcontrollers (MCUs) are part of the MSP highly integrated, ultra-low-power 32-bit MCU family based on the enhanced Arm®Cortex®-M0+ 32-bit core platform operating at up to 80MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages ranging from 1.62V to 3.6V.

The MSPM0G150x devices provide up to 128KB embedded flash program memory with built-in error correction code (ECC) and up to 32KB SRAM with hardware parity option. These MCUs also incorporate a memory protection unit, 7-channel DMA, math accelerator, and a variety of high-performance analog peripherals such as two 12-bit 4-Msps ADCs, configurable internal shared voltage reference, one 12-bit 1-Msps DAC, three high speed comparators with built-in reference DACs, two zero-drift zero-crossover op-amps with programmable gain, and one general-purpose amplifier. These devices also offer intelligent digital peripherals such as two 16-bit advanced control timers, five general-purpose timers (with one 16-bit general-purpose timer for QEI interface, two 16-bit general-purpose timers for STANDBY mode, and one 32-bit general-purpose timer), two windowed-watchdog timers, and one RTC with alarm and calendar modes. These devices provide data integrity and encryption peripherals (AES, CRC, TRNG) and enhanced communication interfaces (four UART, two I2C, two SPI).

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration that allow customers to find the MCU that meets project needs. The MSPM0 MCU platform combines the Arm Cortex-M0+ platform with a holistic ultra-low-power system architecture, allowing system designers to increase performance while reducing energy consumption.

MSPM0G150x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits available for purchase include a LaunchPad™ development kit. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 G-Series 80MHz Microcontrollers Technical Reference Manual.

Table 3-1 Device Comparison
DEVICE NAMEPackagePACKAGE SIZE
MSPM0G1505SPMR64 LQFP12mm × 12mm
MSPM0G1506SPMR
MSPM0G1507SPMR
MSPM0G1505SPTR48 LQFP9mm × 9mm
MSPM0G1506SPTR
MSPM0G1507SPTR
MSPM0G1505SRGZR48 VQFN7mm × 7mm
MSPM0G1506SRGZR
MSPM0G1507SRGZR
MSPM0G1505RHBR32 VQFN5mm × 5mm
MSPM0G1506SRHBR
MSPM0G1507SRHBR
MSPM0G1505SDGSR2828 VSSOP7.1mm × 4.9mm
MSPM0G1506SDGSR28
MSPM0G1507SDGSR28
MSPM0G1505SRGER24 VQFN4mm × 4mm
MSPM0G1506SRGER
MSPM0G1507SRGER
MSPM0G1506SYCJR28 DSBGA2.65 mm × 1.57 mm
MSPM0G1507SYCJR
CAUTION:

System-level ESD protection must be applied in compliance with the device-level ESD specification to prevent electrical overstress or disturbing of data or code memory. See MSP430™ System-Level ESD Considerations for more information. The principles in this application note are applicable to MSPM0 MCUs.