SLLS007E July 1985 – March 2024 SN75ALS192
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | D (SOIC) | NS (SOP) | UNIT | |
---|---|---|---|---|
16-PINS | ||||
R θJA | Junction-to-ambient thermal resistance | 84.6 | 88.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 43.5 | 46.2 | °C/W |
R θJB | Junction-to-board thermal resistance | 43. | 50. | °C/W |
ψ JT | Junction-to-top characterization parameter | 10.4 | 13.5 | °C/W |
ψ JB | Junction-to-board characterization parameter | 42.8 | 50.3 | °C/W |
R θJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |