SLLSES9D February   2016  – October 2021 TCAN1042-Q1 , TCAN1042G-Q1 , TCAN1042GV-Q1 , TCAN1042H-Q1 , TCAN1042HG-Q1 , TCAN1042HGV-Q1 , TCAN1042HV-Q1 , TCAN1042V-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configurations and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings, Specifications
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Power Rating
    7. 7.7 Electrical Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 TXD Dominant Timeout (DTO)
      2. 9.3.2 Thermal Shutdown (TSD)
      3. 9.3.3 Undervoltage Lockout
      4. 9.3.4 Unpowered Device
      5. 9.3.5 Floating Terminals
      6. 9.3.6 CAN Bus Short Circuit Current Limiting
      7. 9.3.7 Digital Inputs and Outputs
        1. 9.3.7.1 Devices with VCC Only (Devices without the "V" Suffix):
        2. 9.3.7.2 Devices with VIO I/O Level Shifting (Devices with "V" Suffix):
    4. 9.4 Device Functional Modes
      1. 9.4.1 CAN Bus States
      2. 9.4.2 Normal Mode
      3. 9.4.3 Standby Mode
        1. 9.4.3.1 Remote Wake Request via Wake Up Pattern (WUP) in Standby Mode
      4. 9.4.4 Driver and Receiver Function Tables
  10. 10Application Information Disclaimer
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Bus Loading, Length and Number of Nodes
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 CAN Termination
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (March 2019) to Revision D (October 2021)

  • Added Feature: EMC performance:.. Go
  • Added Feature "Functional Safety-Capable"Go
  • Changed the automotive feature, removed temperatures and classification levels Go
  • Deleted "Product Preview" from the DRB pin images in the Pin Configurations and Functions Go
  • Added footnote to the GND pin in the Pin Functions table Go
  • Changed the ESD Ratings table, added HBM and CDM classification levelsGo
  • Changed the DRB (VSON) values in the Thermal Information table Go
  • Changed the title in Section 9.3.7.1 Go
  • Changed the title in Section 9.3.7.2 Go

Changes from Revision B (May 2017) to Revision C (March 2019)

  • Changed the ICC MAX value From: 180 mA To: 110 mA in the Electrical Characteristics Go
  • Changed the tWK_FILTER MAX value From: 1.85 µs To: 1.8 µs in the Switching Characteristics Go

Changes from Revision A (May 2016) to Revision B (May 2017)

  • Changed Feature "Meets the Released ISO 11898-2:2007 and ISO 11898-2:2003 Physical Layer Standards" To: Meets the ISO 11898-2:2016 and ISO 11898-5:2007 Physical Layer StandardsGo
  • Deleted Feature From: Meets the December 17th, 2015 Draft of ISO 11898-2 Physical Layer UpdateGo
  • Changed Feature From: "All devices support 2 Mbps CAN FD.." To: "All Devices Support Classic CAN and 2 Mbps CAN FD.."Go
  • Added Feature "Available in SOIC(8) package and leadless VSON(8) package..."Go
  • Changed Applications From: Heavy Machinery ISO11783 To: Heavy Machinery ISOBUS Applications – ISO 11783Go
  • Changed the Applications listGo
  • Changed Feature From: "EMC: SAE J2962, GIFT/ICT, ISO 16845" To: "Meets requirements of SAE J2962, GIFT/ICT, ISO16845" Go
  • Added new devices to the Device Comparison Table Go
  • Added Storage temperature range to the Section 7.1 tableGo
  • Changed the ESD Ratings table to show the D(SOIC) and DRB (VSON) valuesGo
  • Changed Charged Device Model (CDM) From: ±750 To: ±1500 in the ESD Ratings tableGo
  • Changed TBD to values for the DRB (VSON) Package in the ESD Ratings tableGo
  • Added the DRB package to the Thermal Information table Go
  • Added the Power Rating table Go
  • Changed VSYM in the Driver Electrical Characteristics tableGo
  • Changed VSYM_DC in the Driver Electrical Characteristics tableGo
  • Deleted "VI = 0.4 sin (4E6 π t) + 2.5 V" from the Test Condition of CI in the Receiver Electrical Characteristics tableGo
  • Deleted "VI = 0.4 sin (4E6 π t)" in the Test Condition of CID in the Receiver Electrical Characteristics tableGo
  • Added "-30 V ≤ VCM ≤ +30" to the Test Condition of RID and RIN in the Receiver Electrical Characteristics tableGo
  • Changed the tMODE TYP value From: 1 µs To: 9 µS in the Switching Characteristics tableGo
  • Added Note 2 and Changed Table 9-2, BUS OUTPUT columGo
  • Changed Section 9.4.3 section Go

Changes from Revision * (March 2016) to Revision A (May 2016)

  • Added Features "Meets the Released ISO 11898-2:2007 and ISO 11898-2:2003 Physical Layer Standards" Go
  • Changed Feature From: Meets the Requirements of ISO11898-2 (2016) To: Meets the December 17th, 2015 Draft of ISO 11898-2 Physical Layer Update Go
  • Changed the Applications listGo
  • Added the VSON (8) pin package to the Device Information tableGo
  • Added the VSON (8) pin package to the Pin Configuration and Functions Go
  • Added V(Diff) to the Section 7.1 table Go
  • Changed OTP to TSD in the Functional Block Diagram Go
  • Added Note 2 to Table 9-1 Go
  • Added Note 1 to Table 9-2 Go
  • Added pin number to the Section 12.2 image Go