SNOSDK9B September   2025  – December 2025 TLV3214

PRODMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
    1. 4.1 Pin Configuration: TLV3211, TLV3221
    2. 4.2 Pin Configurations: TLV3212, TLV3222
    3. 4.3 Pin Configurations: TLV3214
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information - Single
    5. 5.5 Thermal Information - Dual
    6. 5.6 Thermal Information - Quad
    7. 5.7 Electrical Characteristics
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Inputs
        1. 6.4.1.1 Unused Inputs
      2. 6.4.2 Internal Hysteresis
      3. 6.4.3 Outputs
        1. 6.4.3.1 TLV321x Push-Pull Output
        2. 6.4.3.2 TLV322x Open Drain Output
      4. 6.4.4 ESD Protection
      5. 6.4.5 Power-On Reset (POR)
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Basic Comparator Definitions
        1. 7.1.1.1 Operation
        2. 7.1.1.2 Propagation Delay
        3. 7.1.1.3 Overdrive Voltage
      2. 7.1.2 External Hysteresis
        1. 7.1.2.1 Inverting Comparator With Hysteresis
        2. 7.1.2.2 Non-Inverting Comparator With Hysteresis
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Sensing
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Internal Hysteresis

The TLV32xx family contains 1.8mV of internal hysteresis.

The device hysteresis transfer curve is shown below. This curve is a function of three components: VTH, VOS, and VHYST:

  • VTH is the actual set voltage or threshold trip voltage.
  • VOS is the internal offset voltage between VIN+ and VIN–. This voltage is added to VTH to form the actual trip point at which the comparator must respond to change output states.
  • VHYST is the internal hysteresis (or trip window) that is designed to reduce comparator sensitivity to noise.

TLV3211 TLV3212 TLV3214 TLV3221 TLV3222 Hysteresis Transfer CurveFigure 6-3 Hysteresis Transfer Curve