SNOSDK9B September   2025  – December 2025 TLV3214

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1. 4.1 Pin Configuration: TLV3211, TLV3221
    2. 4.2 Pin Configurations: TLV3212, TLV3222
    3. 4.3 Pin Configurations: TLV3214
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information - Single
    5. 5.5 Thermal Information - Dual
    6. 5.6 Thermal Information - Quad
    7. 5.7 Electrical Characteristics
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Inputs
        1. 6.4.1.1 Unused Inputs
      2. 6.4.2 Internal Hysteresis
      3. 6.4.3 Outputs
        1. 6.4.3.1 TLV321x Push-Pull Output
        2. 6.4.3.2 TLV322x Open Drain Output
      4. 6.4.4 ESD Protection
      5. 6.4.5 Power-On Reset (POR)
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Basic Comparator Definitions
        1. 7.1.1.1 Operation
        2. 7.1.1.2 Propagation Delay
        3. 7.1.1.3 Overdrive Voltage
      2. 7.1.2 External Hysteresis
        1. 7.1.2.1 Inverting Comparator With Hysteresis
        2. 7.1.2.2 Non-Inverting Comparator With Hysteresis
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Sensing
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.3 Pin Configurations: TLV3214

Figure 4-1 PW Package
14-Pin TSSOP
Top View
NOTE: Connect exposed thermal pad directly to V- pin.
Figure 4-2 RTE Package
16-Pin WQFN With Exposed Thermal Pad
Top View
Table 4-3 Pin Functions: TLV3214
PIN TYPE(1) DESCRIPTION
NAME TSSOP WQFN
IN1– 2 16 I Inverting input, channel A
IN1+ 3 1 I Noninverting input, channel A
IN2– 6 5 I Inverting input, channel B
IN2+ 5 4 I Noninverting input, channel B
IN3– 9 8 I Inverting input, channel C
IN3+ 10 9 I Noninverting input, channel C
IN4– 13 13 I Inverting input, channel D
IN4+ 12 12 I Noninverting input, channel D
NC — 3, 10 — No internal connection
OUT1 1 15 O Output, channel A
OUT2 7 6 O Output, channel B
OUT3 8 7 O Output, channel C
OUT4 14 14 O Output, channel D
V- 11 11 — Negative (lowest) supply or ground (for single-supply operation)
V+ 4 2 — Positive (highest) supply
Thermal Pad — Pad — Thermal Pad - Connect directly to V-
(1) I = input, O = output