SNOSDK9B September   2025  – December 2025 TLV3214

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1. 4.1 Pin Configuration: TLV3211, TLV3221
    2. 4.2 Pin Configurations: TLV3212, TLV3222
    3. 4.3 Pin Configurations: TLV3214
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information - Single
    5. 5.5 Thermal Information - Dual
    6. 5.6 Thermal Information - Quad
    7. 5.7 Electrical Characteristics
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Inputs
        1. 6.4.1.1 Unused Inputs
      2. 6.4.2 Internal Hysteresis
      3. 6.4.3 Outputs
        1. 6.4.3.1 TLV321x Push-Pull Output
        2. 6.4.3.2 TLV322x Open Drain Output
      4. 6.4.4 ESD Protection
      5. 6.4.5 Power-On Reset (POR)
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Basic Comparator Definitions
        1. 7.1.1.1 Operation
        2. 7.1.1.2 Propagation Delay
        3. 7.1.1.3 Overdrive Voltage
      2. 7.1.2 External Hysteresis
        1. 7.1.2.1 Inverting Comparator With Hysteresis
        2. 7.1.2.2 Non-Inverting Comparator With Hysteresis
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Sensing
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4.1.1 Unused Inputs

If a channel is not to be used, DO NOT tie the inputs together. Due to the high equivalent bandwidth and low offset voltage, tying the inputs directly together can cause high frequency chatter as the device triggers on it's own internal wideband noise. Instead, the inputs must be tied to any available voltage that resides within the specified input voltage range and provides a minimum of 50mV differential voltage. For example, one input can be grounded and the other input connected to a reference voltage, or even V+ (as long as the input is directly connected to the V+ pin to avoid transients).