SBOS966H april   2019  – june 2023 TLV9061-Q1 , TLV9062-Q1 , TLV9064-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Device Comparison Table
  8. 7 Pin Configuration and Functions
  9. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information: TLV9061-Q1
    5. 8.5 Thermal Information: TLV9062-Q1
    6. 8.6 Thermal Information: TLV9064-Q1
    7. 8.7 Electrical Characteristics
    8. 8.8 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Rail-to-Rail Input
      2. 9.3.2 Rail-to-Rail Output
      3. 9.3.3 Overload Recovery
      4. 9.3.4 Shutdown Function
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Typical Low-Side Current Sense Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Typical Comparator Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Input and ESD Protection
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.6 Thermal Information: TLV9064-Q1

THERMAL METRIC(1)TLV9064-Q1UNIT
PW (TSSOP)D (SOIC)
14 PINS14 PINS
RθJAJunction-to-ambient thermal resistance133.8111.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance62.167.6°C/W
RθJBJunction-to-board thermal resistance76.967°C/W
ψJTJunction-to-top characterization parameter13.227.4°C/W
ψJBJunction-to-board characterization parameter76.366.6°C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.