SCDS383F August   2018  – July 2025 TMUX6111 , TMUX6112 , TMUX6113

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Electrical Characteristics (Dual Supplies: ±15V)
    6. 6.6 Switching Characteristics (Dual Supplies: ±15V)
    7. 6.7 Electrical Characteristics (Single Supply: 12V)
    8. 6.8 Switching Characteristics (Single Supply: 12V)
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Truth Tables
  9. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1  On-Resistance
      2. 8.1.2  Off-Leakage Current
      3. 8.1.3  On-Leakage Current
      4. 8.1.4  Break-Before-Make Delay
      5. 8.1.5  Turn-On and Turn-Off Time
      6. 8.1.6  Charge Injection
      7. 8.1.7  Off Isolation
      8. 8.1.8  Channel-to-Channel Crosstalk
      9. 8.1.9  Bandwidth
      10. 8.1.10 THD + Noise
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Ultra-low Leakage Current
      2. 8.3.2 Ultra-low Charge Injection
      3. 8.3.3 Bidirectional and Rail-to-Rail Operation
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Thermal Information

THERMAL METRIC(1)TMUX6111/ TMUX6112/ TMUX6113UNIT
PW (TSSOP)RTE (QFN)
16 PINS16 PINS
RθJAJunction-to-ambient thermal resistance111.051.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance41.753.3°C/W
RθJBJunction-to-board thermal resistance57.226.6°C/W
ΨJTJunction-to-top characterization parameter4.11.7°C/W
ΨJBJunction-to-board characterization parameter56.626.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/A11.6°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.