SCDS435 September   2021 TMUX8108 , TMUX8109

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings: TMUX810x Devices
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information: TMUX810x
    4. 6.4  Recommended Operating Conditions: TMUX810x Devices
    5. 6.5  Electrical Characteristics (Global): TMUX810x Devices
    6. 6.6  Electrical Characteristics (±36-V Dual Supply)
    7. 6.7  Electrical Characteristics (72-V Single Supply)
    8. 6.8  Electrical Characteristics (100-V Single Supply)
    9. 6.9  Switching Characteristics: TMUX810x Devices
    10. 6.10 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1  Truth Tables
    2. 7.2  On-Resistance
    3. 7.3  Off-Leakage Current
    4. 7.4  On-Leakage Current
    5. 7.5  Break-Before-Make Delay
    6. 7.6  Enable Delay Time
      1. 7.6.1 Device Turn On Time
    7. 7.7  Transition Time
    8. 7.8  Charge Injection
    9. 7.9  Off Isolation
    10. 7.10 Crosstalk
    11. 7.11 Bandwidth
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Flat On - Resistance
      2. 8.3.2 Protection Features
        1. 8.3.2.1 Fail-Safe Logic
        2. 8.3.2.2 Latch-up Immunity
      3. 8.3.3 Bidirectional Operation
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

The image below illustrates an example of a PCB layout with the TMUX8108 and TMUX8109. Some key considerations are:

  • Decouple the VDD and VSS pins with a 0.1-µF and 1-µFcapacitor, placed as close to the pin as possible. Make sure that the capacitor voltage rating is sufficient for the VDD and VSS supplies.
  • Keep the input lines as short as possible.
  • Use a solid ground plane to help distribute heat and reduce electromagnetic interference (EMI) noise pickup.
  • Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if possible, and only make perpendicular crossings when necessary.