Product details

Configuration 4:1 Number of channels 2 Power supply voltage - single (V) 12, 16, 20, 36, 44, 72, 100 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-36, +/-50 Protocols Analog Ron (typ) (Ω) 38 CON (typ) (pF) 12 ON-state leakage current (max) (µA) 0.04 Supply current (typ) (µA) 250 Bandwidth (MHz) 380 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Integrated pulldown resistor on logic pin Input/output continuous current (max) (mA) 50 Rating Catalog Drain supply voltage (max) (V) 50 Supply voltage (max) (V) 100 Negative rail supply voltage (max) (V) -50
Configuration 4:1 Number of channels 2 Power supply voltage - single (V) 12, 16, 20, 36, 44, 72, 100 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-36, +/-50 Protocols Analog Ron (typ) (Ω) 38 CON (typ) (pF) 12 ON-state leakage current (max) (µA) 0.04 Supply current (typ) (µA) 250 Bandwidth (MHz) 380 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Integrated pulldown resistor on logic pin Input/output continuous current (max) (mA) 50 Rating Catalog Drain supply voltage (max) (V) 50 Supply voltage (max) (V) 100 Negative rail supply voltage (max) (V) -50
TSSOP (PW) 16 32 mm² 5 x 6.4 WQFN (RUM) 16 16 mm² 4 x 4
  • High supply voltage capable:
    • Dual supply: ±10 V to ±50 V
    • Single supply: 10 V to 100 V
    • Asymmetric dual supply operation
  • Consistent parametrics across supply voltages

  • Latch-up immune
  • Low crosstalk: –110 dB
  • Low input leakage: 40 pA
  • Low on resistance flatness: 0.5 Ω
  • Removes need for additional logic rail (V L)
  • 1.8 V Logic capable
  • Fail-safe logic: up to 48 V independent of supply
  • Integrated pull-down resistor on logic pins
  • Bidirectional signal path
  • Break-before-make switching
  • Wide operating temperature T A: –40°C to 125°C
  • Industry-standard TSSOP and smaller WQFN packages
  • High supply voltage capable:
    • Dual supply: ±10 V to ±50 V
    • Single supply: 10 V to 100 V
    • Asymmetric dual supply operation
  • Consistent parametrics across supply voltages

  • Latch-up immune
  • Low crosstalk: –110 dB
  • Low input leakage: 40 pA
  • Low on resistance flatness: 0.5 Ω
  • Removes need for additional logic rail (V L)
  • 1.8 V Logic capable
  • Fail-safe logic: up to 48 V independent of supply
  • Integrated pull-down resistor on logic pins
  • Bidirectional signal path
  • Break-before-make switching
  • Wide operating temperature T A: –40°C to 125°C
  • Industry-standard TSSOP and smaller WQFN packages

The TMUX8108 and TMUX8109 are modern high voltage capable analog multiplexers in 8:1 (single ended) and 4:1 (differential) configurations. The devices work well with dual supplies, a single supply, or asymmetric supplies up to a maximum supply voltage of 100 V. The TMUX810x devices provide consistent analog parametric performance across the entire supply voltage range. The TMUX8108 and TMUX8109 support bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins.

All logic inputs support logic levels of 1.8 V, 3.3 V, 5 V and can be connected as high as 48 V, allowing for system flexibility with control signal voltage. Fail-safe logic circuitry allows voltages on the logic pins to be applied before the supply pin, protecting the device from potential damage.

The device family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows this family of multiplexers to be used in harsh environments.

The TMUX8108 and TMUX8109 are modern high voltage capable analog multiplexers in 8:1 (single ended) and 4:1 (differential) configurations. The devices work well with dual supplies, a single supply, or asymmetric supplies up to a maximum supply voltage of 100 V. The TMUX810x devices provide consistent analog parametric performance across the entire supply voltage range. The TMUX8108 and TMUX8109 support bidirectional analog and digital signals on the source (Sx) and drain (Dx) pins.

All logic inputs support logic levels of 1.8 V, 3.3 V, 5 V and can be connected as high as 48 V, allowing for system flexibility with control signal voltage. Fail-safe logic circuitry allows voltages on the logic pins to be applied before the supply pin, protecting the device from potential damage.

The device family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows this family of multiplexers to be used in harsh environments.

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Technical documentation

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Type Title Date
* Data sheet TMUX810x 100-V, Flat RON, Single 8:1 and Dual 4:1 Multiplexers with Latch-Up Immunity and 1.8-V Logic datasheet (Rev. B) PDF | HTML 03 Aug 2023
Application note How to Handle High Voltage Common Mode Applications using Multiplexers PDF | HTML 03 Oct 2022
Product overview PLC Analog Input Front-End Architectures PDF | HTML 31 Jul 2022
Application note Guarding in Multiplexer Applications PDF | HTML 13 May 2022

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TMUX-24PW-EVM — TMUX generic evaluation module for 16-, 20- and 24-pin PW thin shrink small-outline packages (TSSOP)

The TMUX-24PW-EVM evaluation module allows for the quick prototyping and DC characterization of the TI line of TMUX products that use 16-, 20- or 24-pin TSSOP packages (PW) and is rated for high-voltage operation.

User guide: PDF | HTML
Not available on TI.com
Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
Not available on TI.com
Simulation model

TMUX8109 IBIS Model

SCDM268.ZIP (41 KB) - IBIS Model
Simulation model

TMUX8109 PSpice Model

SCDM277.ZIP (71 KB) - PSpice Model
Package Pins CAD symbols, footprints & 3D models
TSSOP (PW) 16 Ultra Librarian
WQFN (RUM) 16 Ultra Librarian

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Information included:
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