SCDS482A February   2025  – April 2025 TMUX8612

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings: TMUX861x Devices
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions: TMUX861x Devices
    4. 6.4  Source of Drain Continuous Current
    5. 6.5  Source of Drain Pulse Current
    6. 6.6  Thermal Information
    7. 6.7  Electrical Characteristics (Global): TMUX861x Devices
    8. 6.8  Electrical Characteristics (±15V Dual Supply)
    9. 6.9  Electrical Characteristics (±36V Dual Supply)
    10. 6.10 Electrical Characteristics (±50V Dual Supply)
    11. 6.11 Electrical Characteristics (72V Single Supply)
    12. 6.12 Electrical Characteristics (100V Single Supply)
    13. 6.13 Switching Characteristics: TMUX861x Devices
    14. 6.14 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 On-Resistance
    2. 7.2 Off-Leakage Current
    3. 7.3 On-Leakage Current
    4. 7.4 Device Turn-On and Turn-Off Time
    5. 7.5 Charge Injection
    6. 7.6 Off Isolation
    7. 7.7 Crosstalk
    8. 7.8 Bandwidth
    9. 7.9 THD + Noise
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Flat On-Resistance
      3. 8.3.3 Protection Features
        1. 8.3.3.1 Fail-Safe Logic
        2. 8.3.3.2 ESD Protection
        3. 8.3.3.3 Latch-Up Immunity
      4. 8.3.4 1.8V Logic Compatible Inputs
      5. 8.3.5 Integrated Pull-Down Resistor on Logic Pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Mode
      2. 8.4.2 Truth Tables
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • High supply voltage capable:
    • Dual supply: ±10V to ±50V
    • Single supply: 10V to 100V
    • Asymmetric dual supply operation: including +10V / –90V
  • Consistent parametric across supply voltages
  • Latch-up immune
  • High continuous current: 150mA
  • Low input leakage: 110pA at 50°C
  • Low charge injection: –13pC
  • Low off isolation & crosstalk: < –100dB
  • Low On-Resistance flatness: 0.4Ω
  • Low On-Resistance: 14Ω
  • Low off-capacitance: 7pF
  • Removes need for additional logic rail (VL)
  • 1.8V Logic capable
  • Fail-safe logic: up to 48V independent of supply
  • Integrated Pull-Down resistor on logic pins
  • Bidirectional signal path
  • Wide operating temperature TA: –40°C to 125°C
  • Industry-standard small WQFN package