SLASEN3B January   2018  – August 2018 TPA3220

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Audio Characteristics (BTL)
    7. 7.7 Audio Characteristics (PBTL)
    8. 7.8 Typical Characteristics, BTL Configuration, AD-mode
    9. 7.9 Typical Characteristics, PBTL Configuration, AD-mode
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 Internal LDO
        1. 9.3.1.1 Input Configuration, Gain Setting And Master / Slave Operation
      2. 9.3.2 Gain Setting And Master / Slave Operation
      3. 9.3.3 AD-Mode and HEAD-Mode PWM Modulation
      4. 9.3.4 Oscillator
      5. 9.3.5 Input Impedance
      6. 9.3.6 Error Reporting
    4. 9.4 Device Functional Modes
      1. 9.4.1 Powering Up
        1. 9.4.1.1 Startup Ramp Time
      2. 9.4.2 Powering Down
        1. 9.4.2.1 Power Down Ramp Time
      3. 9.4.3 Device Reset
      4. 9.4.4 Device Soft Mute
      5. 9.4.5 Device Protection System
        1. 9.4.5.1 Overload and Short Circuit Current Protection
        2. 9.4.5.2 Signal Clipping and Pulse Injector
        3. 9.4.5.3 DC Speaker Protection
        4. 9.4.5.4 Pin-to-Pin Short Circuit Protection (PPSC)
        5. 9.4.5.5 Overtemperature Protection OTW and OTE
        6. 9.4.5.6 Undervoltage Protection (UVP) and Power-on Reset (POR)
        7. 9.4.5.7 Fault Handling
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Stereo BTL Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedures
          1. 10.2.1.2.1 Decoupling Capacitor Recommendations
          2. 10.2.1.2.2 PVDD Capacitor Recommendation
          3. 10.2.1.2.3 BST capacitors
          4. 10.2.1.2.4 PCB Material Recommendation
      2. 10.2.2 Typical Application, Differential (2N), AD-Mode PBTL (Outputs Paralleled before LC filter)
        1. 10.2.2.1 Design Requirements
      3. 10.2.3 Typical Application, Differential (2N), AD-Mode PBTL (Outputs Paralleled after LC filter)
        1. 10.2.3.1 Design Requirements
  11. 11Power Supply Recommendations
    1. 11.1 Power Supplies
      1. 11.1.1 VDD Supply
      2. 11.1.2 AVDD and GVDD Supplies
      3. 11.1.3 PVDD Supply
      4. 11.1.4 BST Supply
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
      1. 12.2.1 BTL Application Printed Circuit Board Layout Example
      2. 12.2.2 PBTL (Outputs Paralleled before LC filter) Application Printed Circuit Board Layout Example
      3. 12.2.3 PBTL (Outputs Paralleled after LC filter) Application Printed Circuit Board Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDW|44
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4.3 Device Reset

Asserting RESET low initiates the device ramp down. The output FETs go into a Hi-Z state after the ramp down is complete. Output pull downs are active in both BTL mode and PBTL mode with RESET low.

In BTL modes, to accommodate bootstrap charging prior to switching start, asserting the RESET input low enables weak pull-down of the half-bridge outputs.

Asserting RESET low removes any fault information to be signaled on the FAULT output, that is, FAULT is forced high. A rising-edge transition on RESET allows the device to resume operation after a fault. To ensure thermal reliability, the rising edge of RESET must occur no sooner than 4 ms after the falling edge of FAULT.

The TPA3220 will enter a low power state once the ramp down sequence is complete.