SLLSEU8B March 2017 – May 2020 TPD2S703-Q1
PRODUCTION DATA.
THERMAL METRIC(1) | TPD2S703-Q1 | UNIT | ||
---|---|---|---|---|
DGS (VSSOP) | DSK (WSON) | |||
10 PINS | 10 PINS | |||
θJA | Junction-to-ambient thermal resistance | 167.3 | 61.5 | °C/W |
θJCtop | Junction-to-case (top) thermal resistance | 56.9 | 51.3 | °C/W |
θJB | Junction-to-board thermal resistance | 87.6 | 34 | °C/W |
ψJT | Junction-to-top characterization parameter | 7.7 | 1.3 | °C/W |
ψJB | Junction-to-board characterization parameter | 86.2 | 34.3 | °C/W |
θJCbot | Junction-to-case (bottom) thermal resistance | N/A | 7.7 | °C/W |