SLIS113E October   2004  – May 2022 TPIC1021

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 LIN Bus Pin
        1. 8.3.1.1 Transmitter Characteristics
        2. 8.3.1.2 Receiver Characteristics
      2. 8.3.2 Transmit Input Pin (TXD)
        1. 8.3.2.1 TXD Dominant State Timeout
      3. 8.3.3 Receive Output Pin (RXD)
        1. 8.3.3.1 RXD Wake-up Request
      4. 8.3.4 Ground (GND)
      5. 8.3.5 Enable Input Pin (EN)
      6. 8.3.6 NWake Input Pin (NWake)
      7. 8.3.7 Inhibit Output Pin (INH)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating States
        1. 8.4.1.1 Normal Mode
        2. 8.4.1.2 Low Power Mode
        3. 8.4.1.3 Wake-Up Events
        4. 8.4.1.4 Standby Mode
      2. 8.4.2 Supply Voltage (VSUP)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • LIN physical layer specification revision 2.1 compliant conforms to SAEJ2602 recommended practice for LIN
  • LIN bus speed up to 20 kbps
  • ESD protection to 12 kV (human body model) on LIN pin
  • LIN pin handles voltage from –40 V to 40 V
  • Survives transient damage in automotive environment (ISO 7637)
  • Operation with supply from 7-V to 27-V DC
  • Two operation modes: normal and low-power (sleep) mode
  • Low current consumption in low power mode
  • Wake-up available from LIN bus, wake-up input (external switch) or host MCU
  • Interfaces to MCU with 5-V or 3.3-V I/O pins
  • Dominant state timeout protection on TXD pin
  • Wake-up request on RXD pin
  • Control of external voltage regulator (INH Pin)
  • Integrated pull-up resistor and series diode for LIN responder applications
  • Low EME (electromagnetic emissions), high EMI (electromagnetic immunity)
  • Bus terminal short-circuit protected for short to battery or short to ground
  • Thermally protected
  • Ground disconnection fail-safe at system level
  • Ground shift operation at system level
  • Unpowered node does not disturb the network