SLIS113E October   2004  – May 2022 TPIC1021

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 LIN Bus Pin
        1. 8.3.1.1 Transmitter Characteristics
        2. 8.3.1.2 Receiver Characteristics
      2. 8.3.2 Transmit Input Pin (TXD)
        1. 8.3.2.1 TXD Dominant State Timeout
      3. 8.3.3 Receive Output Pin (RXD)
        1. 8.3.3.1 RXD Wake-up Request
      4. 8.3.4 Ground (GND)
      5. 8.3.5 Enable Input Pin (EN)
      6. 8.3.6 NWake Input Pin (NWake)
      7. 8.3.7 Inhibit Output Pin (INH)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating States
        1. 8.4.1.1 Normal Mode
        2. 8.4.1.2 Low Power Mode
        3. 8.4.1.3 Wake-Up Events
        4. 8.4.1.4 Standby Mode
      2. 8.4.2 Supply Voltage (VSUP)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (June 2015) to Revision E (May 2022)

  • Changed Feature From: "...Revision 2.0 compliant" To: "... Revision 2.1 compliant"Go
  • Changed all instances of legacy terminology to commander and responder where mentionedGo
  • Changed From: "LIN Physical Layer Specification Revision 2.0" To: "LIN Physical Layer Specification Revision 2.1" in the Description (continued) Go
  • Added: (LIN 2.1 compatible) to Note 2 of the Timing Requirements Go
  • Changed paragraph three in the Transmitter Characteristics section.Go
  • Changed three instances of "IHN" to "INH" in Figure 8-1 Go

Changes from Revision C (July 2005) to Revision D (June 2015)

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go