SLVSH72 December   2023 TPS281C100

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Options
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
    4. 8.4 Working Mode
    5. 8.5 Feature Description
      1. 8.5.1 Accurate Current Sense
        1. 8.5.1.1 High Accuracy Sense Mode
      2. 8.5.2 Programmable Current Limit
        1. 8.5.2.1 Short-Circuit and Overload Protection
        2. 8.5.2.2 Capacitive Charging
      3. 8.5.3 Inductive-Load Switching-Off Clamp
      4. 8.5.4 Inductive Load Demagnetization
      5. 8.5.5 Full Protections and Diagnostics
        1. 8.5.5.1 Open-Load Detection
        2. 8.5.5.2 Thermal Protection Behavior
        3. 8.5.5.3 Undervoltage Lockout (UVLO) Protection
        4. 8.5.5.4 Reverse Polarity Protection
        5. 8.5.5.5 Protection for MCU I/Os
        6. 8.5.5.6 Diagnostic Enable Function
        7. 8.5.5.7 Loss of Ground
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 IEC 61000-4-4 EFT
        2. 9.2.1.2 IEC 61000-4-5 Surge
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting RILIM
        2. 9.2.2.2 Selecting RSNS
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 EMC Considerations
      2. 9.4.2 Layout Example
        1. 9.4.2.1 PWP Layout Without a GND Network
        2. 9.4.2.2 PWP Layout With a GND Network
        3. 9.4.2.3 DNT Layout Without a GND Network
      3. 9.4.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DNT|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

ESD Ratings

VALUE UNIT
VESD Electrostatic discharge Human body model (HBM), per
ANSI/ESDA/JEDEC JS-001(1)
All pins except VS and VOUT ±2000 V
Human body model (HBM), per
ANSI/ESDA/JEDEC JS-001(1)
VS and VOUT with respect to GND ±4000 V
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins(2)
All pins ±750 V
V(ESD4) Electrostatic discharge Contact discharge, per IEC 61000-4-2 (3) VS and VOUT ±8000 V
V(EFT) Electrostatic discharge Electrical fast transient, per IEC 61000-4-4 (3) VS and VOUT ±2000 V
V(surge) Electrostatic discharge Surge protection with 42 Ω, per IEC 61000-4-5; 1.2/50 μs (4) VS and VOUT ±1000 V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Tested with application circuit and supply voltage (VS) of 24-V, ENx pins High (Output Enabled) and and EN pins Low (Outputs Disabled).
Tested with application circuit and supply voltage (VS) of 24-V, ENx pins High (Output Enabled) and and EN pins Low (Outputs Disabled). External TVS at VS and VOUT required. Please refer to the IEC 61000-4-5 Surge section.