SLVS331I December   2000  – October 2021

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
    1.     6
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Dissipation Ratings
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Voltage (VDD)
        1. 8.3.1.1 VDD Hysteresis
        2. 8.3.1.2 VDD Glitch Immunity
      2. 8.3.2 User-Programmable Watchdog Timer (WDI)
      3. 8.3.3 RESET Output
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation (VDD > VIT)
      2. 8.4.2 Above Power-On Reset But Less Than Threshold (VPOR < VDD < VIT)
      3. 8.4.3 Below Power-On Reset (VDD < VPOR)
    5. 8.5 Programming
      1. 8.5.1 Implementing Window-Watchdog Settings
      2. 8.5.2 Programmable Window-Watchdog by Using an External Capacitor
      3. 8.5.3 Lower Boundary Calculation
      4. 8.5.4 Watchdog Software Considerations
      5. 8.5.5 Power-Up Considerations
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC (1) TPS3813xxx UNIT
DBV (SOT-23)
6 PINS
RθJA Junction-to-ambient thermal resistance 208.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 123.3 °C/W
RθJB Junction-to-board thermal resistance 37.2 °C/W
ψJT Junction-to-top characterization parameter 14.6 °C/W
ψJB Junction-to-board characterization parameter 36.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.