SLVSD05H March   2016  – June 2025 TPS56C215

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  PWM Operation and D-CAP3™ Control Mode
      2. 6.3.2  Eco-mode Control
      3. 6.3.3  4.7-V LDO
      4. 6.3.4  MODE Selection
      5. 6.3.5  Soft Start and Prebiased Soft Start
      6. 6.3.6  Enable and Adjustable UVLO
      7. 6.3.7  Power Good
      8. 6.3.8  Overcurrent Protection and Undervoltage Protection
      9. 6.3.9  Transient Response Enhancement
      10. 6.3.10 UVLO Protection
      11. 6.3.11 Thermal Shutdown
      12. 6.3.12 Output Voltage Discharge
    4. 6.4 Device Functional Modes
      1. 6.4.1 Light Load Operation
      2. 6.4.2 Standby Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design With WEBENCH® Tools
        2. 7.2.2.2 External Component Selection
          1. 7.2.2.2.1 Output Voltage Set Point
          2. 7.2.2.2.2 Switching Frequency and MODE Selection
          3. 7.2.2.2.3 Inductor Selection
          4. 7.2.2.2.4 Output Capacitor Selection
          5. 7.2.2.2.5 Input Capacitor Selection
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Development Support
        1. 8.1.2.1 Custom Design With WEBENCH® Tools
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Package Marking

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision G (August 2024) to Revision H (June 2025)

  • Changed MOSFET values from 13.5mΩ and 4.5mΩ to 7.8mΩ and 3.2mΩGo
  • Added WEBENCH link in the Features Go
  • Updated Figure 3-1 figure to include the most recent data for the deviceGo
  • Updated RDS(on)H from 13.5 mΩ to 7.8 mΩ , RDS(on)L from 4.5 mΩ to 3.2 mΩ and tUVPEN hiccup time from 7 cycles to 14 cyclesGo
  • Changed IIN typ value from 600µA to 146µA and deleted IIN max valueGo
  • Changed IVINSDN typ value from 7µA to 9.3µAGo
  • Changed VPGOODTH VFB falling (good) value from 107% to 108%Go
  • Changed VUVP value from 68% to 70%Go
  • Changed UVLO VREG5 rising voltage value from 4.3V to 4.25VGo
  • Changed UVLO VREG5 falling voltage value from 3.57V to 3.52Go
  • Changed UVLO, VREG5 = 4.7V VIN falling voltage, VREG5 = 4.7V value from 3.26V to 3.24VGo
  • Changed UVLO, VREG5 = 4.7V VIN hysteresis, VREG5 = 4.7V value from 60mV to 80mVGo
  • Changed tON min value from 54ns to 60nsGo
  • Changed tSS value from 1.045ms to 1.2msGo
  • Updated Figure 5-9 to Figure 5-34 to include the most recent data for the deviceGo
  • Deleted High-side RDS(on) vs Temperature and Low-side RDS(on) vs Temperature figuresGo
  • Changes MOSFET values from 13.5-mΩ to 7.8-mΩ and 4.5-mΩ to 3.2-mΩGo
  • Changed "Zero Location" values in Table 6-1 from 7.1 to 17.8, from 14.3 to 27.1, from 21.4 to 29.8Go
  • Changed wait time from 1 ms to 1 × tSS and hiccup time from 7ms to 14 × tSS Go
  • Added the Transient Response Enhancement sectionGo
  • Added Custom Design With WEBENCH® Tools sectionGo
  • Updated Application Curves to include the most recent data for the deviceGo
  • Added Custom Design With WEBENCH® Tools sectionGo

Changes from Revision F (August 2023) to Revision G (August 2024)

  • Changed description "TI's smallest" to "a small" with updated products portfolio. Go
  • Deleted TSDN VREG5 specGo
  • Added note "Specified by design" for the SW On Time parameterGo
  • Removed Out-of-Bounds Operation sectionGo
  • Updated Thermal Shutdown sectionGo