SLVSI31 April   2026 TPS61371

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Undervoltage Lockout
      2. 6.3.2  Enable and Disable
      3. 6.3.3  Output Voltage Setting
      4. 6.3.4  Reference Voltage Slew Rate
      5. 6.3.5  Error Amplifier
      6. 6.3.6  Bootstrap Voltage (BST)
      7. 6.3.7  Load Disconnect
      8. 6.3.8  Output Discharge
      9. 6.3.9  Overvoltage Protection
      10. 6.3.10 Thermal Shutdown
      11. 6.3.11 Start-Up
      12. 6.3.12 Short Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Operation
      2. 6.4.2 Auto PFM Mode
      3. 6.4.3 Forced PWM Mode
      4. 6.4.4 Mode Selectable
    5. 6.5 Programming
      1. 6.5.1 Serial Interface Description
      2. 6.5.2 Standard-, Fast-, and Fast-Mode Plus Protocol
      3. 6.5.3 I2C Update Sequence
      4. 6.5.4 I2C Target Address
        1. 6.5.4.1 I2C Target Address Description
  8. 7 Register Map
    1. 7.1 Register Description
      1. 7.1.1 Register Map
      2. 7.1.2 Register CONTROL (Register address: 0x01; Default: 0x01)
      3. 7.1.3 Register VOUT (Register address: 0x02; Default: 0x36)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Output Voltage
        2. 8.2.2.2 Selecting the Inductor
        3. 8.2.2.3 Selecting the Output Capacitors
        4. 8.2.2.4 Selecting the Input Capacitors
        5. 8.2.2.5 Loop Stability and Compensation
          1. 8.2.2.5.1 Small Signal Model
        6. 8.2.2.6 Loop Compensation Design Steps
        7. 8.2.2.7 Selecting the Bootstrap Capacitor
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
        1. 8.4.2.1 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

6.3.10 Thermal Shutdown

A thermal shutdown is implemented to prevent the damage due to the excessive heat and power dissipation. Typically, the thermal shutdown occurs at the junction temperature exceeding 150°C (typical). When the thermal shutdown is triggered, the device stops switching and recovers when the junction temperature falls below 130°C (typical).