SLVSI31 April   2026 TPS61371

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Undervoltage Lockout
      2. 6.3.2  Enable and Disable
      3. 6.3.3  Output Voltage Setting
      4. 6.3.4  Reference Voltage Slew Rate
      5. 6.3.5  Error Amplifier
      6. 6.3.6  Bootstrap Voltage (BST)
      7. 6.3.7  Load Disconnect
      8. 6.3.8  Output Discharge
      9. 6.3.9  Overvoltage Protection
      10. 6.3.10 Thermal Shutdown
      11. 6.3.11 Start-Up
      12. 6.3.12 Short Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Operation
      2. 6.4.2 Auto PFM Mode
      3. 6.4.3 Forced PWM Mode
      4. 6.4.4 Mode Selectable
    5. 6.5 Programming
      1. 6.5.1 Serial Interface Description
      2. 6.5.2 Standard-, Fast-, and Fast-Mode Plus Protocol
      3. 6.5.3 I2C Update Sequence
      4. 6.5.4 I2C Target Address
        1. 6.5.4.1 I2C Target Address Description
  8. 7 Register Map
    1. 7.1 Register Description
      1. 7.1.1 Register Map
      2. 7.1.2 Register CONTROL (Register address: 0x01; Default: 0x01)
      3. 7.1.3 Register VOUT (Register address: 0x02; Default: 0x36)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Output Voltage
        2. 8.2.2.2 Selecting the Inductor
        3. 8.2.2.3 Selecting the Output Capacitors
        4. 8.2.2.4 Selecting the Input Capacitors
        5. 8.2.2.5 Loop Stability and Compensation
          1. 8.2.2.5.1 Small Signal Model
        6. 8.2.2.6 Loop Compensation Design Steps
        7. 8.2.2.7 Selecting the Bootstrap Capacitor
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
        1. 8.4.2.1 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.2.1 Setting the Output Voltage

The output voltage of the TPS61371 is externally adjustable using a resistor divider network. Use Equation 1 to calculate the relationship between the output voltage and the resistor divider.

where

  • VOUT is the output voltage
  • RUP is the top divider resistor
  • RDOWN is the bottom divider resistor

For the best accuracy, TI recommends RDOWN to be around 100kΩ to ensure that the current following through RDOWN is at least 100 times larger than FB pin leakage current. Changing RDOWN toward the lower value increases the robustness against noise injection. Changing RDOWN toward the higher values reduces the quiescent current for achieving higher efficiency at the light load currents.